MPF300T-FCG1152I

The MPF300T-FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It combines a large logic capacity with substantial on-chip memory and a high I/O count in a compact FCBGA package to support complex digital designs.

Key attributes include 300,000 logic elements, approximately 21.09 Mbits of embedded memory, 512 I/O pins, a low-voltage supply range, and an industrial operating temperature range, making it suitable for systems that require integration, density, and reliable operation across wide temperatures.

Key Features

• Core Logic  300,000 logic elements provide the programmable fabric required for complex digital functions and custom logic implementations.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM supports buffering, packet processing, and state storage without external memory for many designs.
• High I/O Density  512 general-purpose I/O pins enable extensive peripheral interfacing and multi-channel data handling in a single device.
• Package and Mounting  1152-BBGA, FCBGA supplier device package (1152-FCBGA (35x35)) with surface-mount mounting type for compact board-level integration.
• Power  Core supply voltage range from 970 mV to 1.08 V to match system power architectures and support low-voltage operation.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing standards.

Typical Applications

• Industrial Automation  Implement control logic, protocol bridging, and sensor interfacing in industrial controllers and factory automation equipment.
• Communications and Networking  Use the device’s logic density and on-chip memory for packet processing, protocol offload, and I/O aggregation in networking equipment.
• Data Acquisition and Processing  Leverage abundant I/O and embedded RAM for multi-channel data capture, preprocessing, and buffering in measurement systems.
• High-density I/O Systems  Integrate large numbers of digital interfaces for board-level consolidation in embedded platforms and instrumentation.

Unique Advantages

• High Logic Capacity: 300,000 logic elements enable complex, custom digital implementations without immediate part changes as designs scale.
• Substantial On-chip Memory: Approximately 21.09 Mbits of embedded RAM reduces reliance on external memory for common buffering and storage tasks.
• Extensive I/O Count: 512 I/O pins simplify system-level integration and reduce the need for additional I/O expanders or multiplexers.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, supporting reliable operation in harsh and outdoor environments.
• Compact FCBGA Package: 1152-FCBGA (35x35) package and surface-mount mounting help save PCB area while providing high pin density.
• RoHS Compliant: Meets common environmental and manufacturing requirements for modern electronic production.

Why Choose MPF300T-FCG1152I?

The MPF300T-FCG1152I positions itself as a high-capacity, industrial-grade FPGA that balances logic resources, on-chip memory, and a large I/O complement in a compact FCBGA package. Its supply voltage range and industrial temperature rating make it suited for robust embedded systems that require sustained operation across varying conditions.

This device is ideal for engineering teams designing industrial controllers, communications equipment, data acquisition systems, and other applications that demand integration, I/O density, and on-chip memory. Choosing this PolarFire™ FPGA offers scalability and a component footprint that supports long-term product roadmaps and system consolidation.

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