MPF300T-FCG484I

The MPF300T-FCG484I is a PolarFire™ FPGA IC from Microchip Technology designed to deliver substantial programmable logic and embedded memory in a compact FCBGA package. This device integrates up to 300,000 logic elements and approximately 21.09 Mbits of on-chip RAM, making it suitable for designs that require high logic density, significant embedded memory, and a large I/O complement.

With a 244-pin I/O count, surface-mount 484-FCBGA package, industrial temperature rating, and a low supply voltage range, the MPF300T-FCG484I targets applications and systems that demand robust operation across extended temperature ranges and efficient core power delivery.

Key Features

• Core Logic — 300,000 logic elements and 75,000 configurable logic blocks (CLBs) provide substantial programmable capacity for complex logic and custom processing functions.
• Embedded Memory — Approximately 21.09 Mbits of on-chip RAM support memory-intensive functions and local buffering to reduce external memory dependence.
• I/O Count — 244 available I/Os enable extensive peripheral interfacing and multi-channel connectivity for complex system integration.
• Power — Core supply operates from 0.97 V to 1.08 V, allowing low-voltage operation consistent with modern power budgets.
• Package & Mounting — 484-FCBGA (23 × 23 mm) surface-mount package (484-BBGA, FCBGA) provides a compact, board-level form factor for dense system layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in equipment requiring extended temperature tolerance.
• Compliance — RoHS compliant to support environmentally conscious designs and regulatory requirements.

Typical Applications

• Logic-Intensive Systems — Implement complex custom logic and protocol processing using the device’s 300,000 logic elements.
• Memory-Heavy Designs — Use the approximately 21.09 Mbits of embedded RAM for on-chip buffering, frame storage, and intermediate data processing.
• I/O-Centric Architectures — Leverage 244 I/Os for multi-channel data collection, sensor interfacing, or dense peripheral connectivity.
• Industrial Equipment — Deploy in systems operating across −40 °C to 100 °C where industrial-grade temperature tolerance is required.

Unique Advantages

• High Logic Capacity: 300,000 logic elements enable implementation of sizeable custom logic, state machines, and datapaths within a single device.
• Significant On-Chip Memory: Approximately 21.09 Mbits of embedded RAM reduce dependence on external memory and simplify board-level BOM.
• Extensive I/O Count: 244 I/Os support complex interfacing and multi-channel connections without immediate need for external multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact FCBGA Package: 484-FCBGA (23 × 23) surface-mount package balances footprint and I/O density for space-constrained designs.
• Low Core Voltage: 0.97–1.08 V supply range helps meet tight power budgets in modern systems.

Why Choose MPF300T-FCG484I?

The MPF300T-FCG484I positions itself as a high-capacity, industrial-temperature FPGA option for designs that require a combination of large programmable logic resources, substantial embedded memory, and abundant I/O in a compact surface-mount FCBGA package. Its electrical and thermal ratings make it suitable for projects where low-voltage core operation and extended temperature tolerance are important.

This device is well suited to engineering teams designing mid-to-high density programmable solutions that benefit from sizeable on-chip RAM, many I/Os, and a RoHS-compliant industrial package. The MPF300T-FCG484I offers a clear resource profile for scalable, board-level integration while aligning to industrial thermal and mounting requirements.

Request a quote or submit a pricing inquiry for the MPF300T-FCG484I to evaluate availability and lead times for your next design.