MPF300T-1FCVG484T2

The MPF300T-1FCVG484T2 is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high logic capacity FPGA fabric combined with significant on‑chip memory and a large I/O count in a compact 484‑BFBGA surface‑mount package.

Designed for applications requiring reconfigurable logic with automotive qualification, this device offers a combination of logic density, embedded memory, and extended operating conditions to support robust embedded designs.

Key Features

• Core logic — Approximately 300,000 logic elements to implement complex custom logic, state machines, and data-paths.
• Embedded memory — Approximately 21.6 Mbits of on‑chip RAM for buffering, FIFOs, and implementation of memory‑based functions.
• I/O capacity — 284 general purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power — Core supply range of 0.97 V to 1.08 V to match system power budgets and core voltage domains.
• Package & mounting — 484‑BFBGA (supplier package: 484‑FBGA, 19×19) in a surface‑mount form factor for high‑density board designs.
• Automotive qualification & temperature range — Grade: Automotive with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in demanding environments.
• RoHS compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Automotive electronic subsystems — Engine, body, and vehicle domain controllers that require automotive‑qualified reconfigurable logic and wide operating temperature coverage.
• High‑density I/O aggregation — Systems that need many external interfaces and signal routing consolidated in a single FPGA device.
• Embedded control and custom logic — Designs that implement custom control, protocol bridging, or glue logic using on‑chip logic and memory resources.

Unique Advantages

• Large logic capacity: Approximately 300,000 logic elements enable complex custom architectures without multiple discrete components.
• Substantial embedded memory: Approximately 21.6 Mbits of on‑chip RAM reduces dependence on external memory for buffering and state storage.
• Automotive grade and AEC‑Q100 qualified: Built and qualified for automotive use, supporting deployment in temperature‑challenging and reliability‑driven environments.
• High I/O count in a compact package: 284 I/O in a 484‑BFBGA package helps minimize board area while maximizing connectivity.
• Wide operating temperature range: −40 °C to 125 °C supports operation across harsh environmental conditions.
• RoHS compliance: Meets environmental regulatory requirements for materials.

Why Choose MPF300T-1FCVG484T2?

The MPF300T-1FCVG484T2 positions itself as a high‑capacity, automotive‑qualified PolarFire™ FPGA that combines substantial logic and embedded memory with extensive I/O in a compact BFBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it appropriate for designs where reliability under temperature stress and automotive compliance are required.

This device is suitable for engineers and procurement teams developing automotive electronic subsystems and other embedded applications that need reconfigurable logic, on‑chip memory, and a dense I/O footprint while maintaining qualification and environmental compliance.

Request a quote or submit an inquiry to get pricing and availability for the MPF300T-1FCVG484T2.