MPF300T-1FCSG536T2

The MPF300T-1FCSG536T2 is a PolarFire™ field programmable gate array (FPGA) IC designed for applications requiring substantial logic density, embedded memory and a compact BGA package. It provides 300,000 logic elements and approximately 21.6 Mbits of on-chip RAM, making it suitable for complex embedded designs that must meet automotive-grade qualification.

With support for 300 I/Os, a low-voltage core supply range and AEC-Q100 qualification, this device targets automotive and harsh-environment electronic systems that need a combination of integration, reliable operation across wide temperatures and industry-standard surface-mount packaging.

Key Features

• Core Logic  300,000 logic elements provide high-density programmable fabric for complex control, signal processing or protocol implementation.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffering, lookup tables and data processing without external memory in many designs.
• I/O Capacity  300 general-purpose I/Os enable interfacing with sensors, peripherals, high-speed links and system buses.
• Power Supply  Core voltage range of 970 mV to 1.08 V supports low-voltage operation and integration with modern power domains.
• Automotive Qualification  AEC-Q100 qualification and Automotive grade classification indicate suitability for automotive electronics and related applications requiring that qualification.
• Package & Mounting  536-LFBGA package (536-BGA, 16×16) in a surface-mount form factor for compact board-level integration.
• Operating Temperature  Rated for −40 °C to 125 °C to support wide-temperature and harsh-environment deployments.
• RoHS Compliance  Device is RoHS compliant for global environmental requirements.

Typical Applications

• Automotive Systems  AEC-Q100 qualification and automotive grading make this FPGA suitable for in-vehicle electronic subsystems that require programmable logic and on-chip memory.
• Embedded Compute and Control  High logic element count and significant embedded RAM support complex control algorithms and data processing in embedded platforms.
• High-Density I/O Platforms  With 300 I/Os, the device fits designs that aggregate sensors, actuators and external interfaces on a single programmable device.
• Harsh-Environment Electronics  Wide operating temperature range supports deployments in thermally demanding environments.

Unique Advantages

• High logic density: 300,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 21.6 Mbits of embedded RAM allow local buffering and lookup storage that can reduce or eliminate external memory in many designs.
• Automotive-ready qualification: AEC-Q100 qualification and Automotive grade help meet vehicle electronics requirements and support qualification processes.
• Wide thermal range: Rated from −40 °C to 125 °C to maintain operation across common automotive and industrial temperature boundaries.
• Compact surface-mount package: 536-LFBGA (536-BGA, 16×16) provides a high-pin-count footprint in a space-efficient form factor for dense board designs.
• Low-voltage core operation: 970 mV to 1.08 V supply range supports integration with modern low-voltage power rails.

Why Choose MPF300T-1FCSG536T2?

The MPF300T-1FCSG536T2 combines a large programmable fabric, significant embedded memory and a robust I/O count in a compact 536-LFBGA package, delivering a highly integrated solution for designers targeting automotive and other temperature-demanding applications. Its AEC-Q100 qualification and RoHS compliance align the device with industry processes and environmental requirements.

This FPGA is well-suited for teams seeking to consolidate functions, manage system complexity and maintain reliable operation across wide temperatures while taking advantage of a high-logic-density, low-voltage programmable device.

Request a quote or submit a pricing inquiry today to evaluate MPF300T-1FCSG536T2 for your next design.