MPF300T-1FCVG484I

The MPF300T-1FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC supplied in a 484-FCBGA (19×19) surface-mount package. It provides a substantial logic fabric with 300,000 logic elements, approximately 21.1 Mbits of embedded memory, and 284 I/O pins for complex, I/O‑rich designs.

Rated for industrial use, the device supports core supply voltages from 0.97 V to 1.08 V and an operating temperature range of -40 °C to 100 °C, making it suitable for designs that require robust thermal and power characteristics within those documented limits.

Key Features

• Logic Capacity — 300,000 logic elements provide a large, reconfigurable fabric for implementing complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 21.1 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many use cases.
• I/O and Package — 284 I/O pins delivered in a 484-FCBGA (19×19) surface-mount package (484-BBGA, FCBGA), enabling dense connectivity in a compact BGA footprint.
• Power — Core supply range of 0.97 V to 1.08 V to match system power architectures that comply with the specified voltage window.
• Industrial Temperature Range — Rated to operate from -40 °C to 100 °C, addressing thermal requirements for industrial environments within the provided range.
• RoHS Compliant — Device is RoHS compliant, meeting standard environmental requirements for lead-free assemblies.

Typical Applications

• Industrial Control & Automation — Use where a large logic count and industrial temperature range are required for real-time control, motor interfaces, and programmable logic functions.
• Communications & Networking — Suitable for board-level implementations that need substantial logic and embedded memory to handle protocol processing and multi‑lane I/O aggregation within the documented I/O count.
• High-density Embedded Processing — Deploy in systems that require significant on-chip logic and RAM to implement custom accelerators, data-paths, or soft processors while maintaining a compact 484-FCBGA footprint.

Unique Advantages

• High Logic Density: 300,000 logic elements enable large-scale integration on a single FPGA die, reducing the need for multiple devices.
• Substantial On‑chip Memory: Approximately 21.1 Mbits of embedded RAM supports buffering and state storage without immediate dependence on external memory.
• Generous I/O Count: 284 I/O pins provide extensive external connectivity for multi-channel systems and dense peripheral interfacing.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C to align with industrial-grade deployment requirements within the specified range.
• Compact BGA Packaging: 484-FCBGA (19×19) surface-mount package balances high pin count and board-level density for space-constrained applications.
• Environmental Compliance: RoHS compliance supports lead‑free manufacturing processes and environmental standards.

Why Choose MPF300T-1FCVG484I?

The MPF300T-1FCVG484I positions itself as a high-capacity PolarFire FPGA option for designers needing a combination of large logic resources, meaningful on-chip memory, and broad I/O in a compact BGA package. Its documented industrial operating range and RoHS compliance make it a pragmatic choice for systems that must meet defined thermal and environmental constraints.

This device is well suited for design teams building complex, I/O-heavy applications that require scalable logic density and embedded memory within the specified power and temperature limits. It delivers a balance of integration and board-level density for long-term designs that align with these documented specifications.

Request a quote or submit an inquiry to obtain pricing and availability for MPF300T-1FCVG484I and to discuss how this PolarFire FPGA can meet your project requirements.