MPF300T-1FCVG484E

The MPF300T-1FCVG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC packaged in a 484-FCBGA (19×19) surface-mount package. It provides a large programmable fabric with substantial embedded memory and a broad complement of I/O for demanding programmable-logic designs.

This device is suited to applications that require significant on-chip logic capacity and embedded RAM while operating within a 0 °C to 100 °C range and a core supply window of 0.970 V to 1.08 V.

Key Features

• Programmable Logic Capacity  Approximately 300,000 logic elements, providing a high-density fabric for complex custom logic and control functions.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, data storage, and intermediate processing without external memory.
• I/O Count  284 general-purpose I/O pins to support extensive peripheral, sensor, and interface connectivity directly from the FPGA package.
• Package and Mounting  484-BBGA / 484-FCBGA (19×19) surface-mount package for compact system integration.
• Power Supply Range  Core supply specified from 0.970 V to 1.08 V for the device core operation.
• Operating Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for a wide set of commercial and embedded environments.
• Standards Compliance  RoHS-compliant status for regulatory and environmental considerations.

Typical Applications

• High-density logic designs  Use where approximately 300,000 logic elements are required to implement complex, custom digital functions and control logic.
• On-chip buffering and data handling  Implement data paths and temporary storage using the device’s approximately 21.09 Mbits of embedded RAM to reduce dependence on external memory.
• Multi-interface systems  Leverage up to 284 I/O pins to connect and aggregate multiple sensors, peripherals, and interfaces within a single FPGA package.

Unique Advantages

• Significant on-chip resources: The combination of roughly 300,000 logic elements and ~21.09 Mbits of embedded RAM enables integration of large functions and reduces external component count.
• High I/O density: 284 available I/Os simplify board-level routing and allow direct interfacing to many peripherals without I/O expanders.
• Compact FCBGA package: The 484-FCBGA (19×19) surface-mount package supports compact system designs while delivering substantial logic and memory resources.
• Controlled supply window: Core voltage range of 0.970 V to 1.08 V provides clear design parameters for power-supply planning and distribution.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and embedded deployment scenarios.
• RoHS compliance: Conforms to RoHS for environmentally conscious designs and regulatory alignment.

Why Choose MPF300T-1FCVG484E?

The MPF300T-1FCVG484E PolarFire™ FPGA from Microchip Technology delivers a sizable programmable fabric combined with substantial embedded RAM and a high I/O count in a 484-FCBGA surface-mount package. Its feature set is positioned for designs that need integrated logic and memory capacity while operating within a defined core voltage window and extended temperature range.

This device is appropriate for engineers and teams looking to consolidate logic functions, minimize external memory and interface components, and implement complex programmable systems with clear electrical and thermal parameters.

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