MPF300T-FCG1152E

The MPF300T-FCG1152E is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for high-density digital designs. It provides 300,000 logic elements, approximately 21.09 Mbits of embedded memory, and 512 I/O pins in a 1152-FCBGA (35×35) package.

This device targets applications that require extensive logic capacity and plentiful I/O while operating within a supply range of 970 mV to 1.08 V and an extended temperature range of 0 °C to 100 °C.

Key Features

• Core Logic 300,000 logic elements to implement complex digital functions and large-scale logic networks.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM for buffering, frame storage, and embedded data structures.
• I/O Count 512 programmable I/O pins to support dense peripheral connectivity and multi-channel interfaces.
• Power Supply Operates from 970 mV to 1.08 V supply, enabling designs constrained to this core voltage range.
• Package & Mounting 1152-BBGA FCBGA package (1152-FCBGA, 35×35) in a surface-mount form factor for board-level integration.
• Operating Range & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for a variety of commercial and controlled-environment applications.
• RoHS Compliant Meets RoHS requirements for material compliance.

Typical Applications

• High-density digital processing Implement complex logic engines and custom processing pipelines using 300,000 logic elements and abundant I/O.
• Memory-centric designs Use the device’s approximately 21.09 Mbits of embedded RAM for frame buffering, data queues, and intermediate storage.
• Multi-channel interfacing 512 I/Os enable aggregation of multiple interfaces and parallel sensor or actuator channels on a single FPGA.

Unique Advantages

• High logic capacity: 300,000 logic elements provide the headroom to consolidate functions that would otherwise require multiple devices.
• Significant on-chip memory: Approximately 21.09 Mbits of embedded RAM reduces external memory dependency for many designs.
• Extensive I/O count: 512 I/Os simplify board-level routing for multi-interface or high-channel-count systems.
• Compact, surface-mount package: 1152-FCBGA (35×35) offers dense integration in space-constrained layouts.
• RoHS compliant: Material compliance supports regulatory and supply-chain requirements.
• Extended-grade thermal range: 0 °C to 100 °C supports deployment in a range of commercial environments.

Why Choose MPF300T-FCG1152E?

The MPF300T-FCG1152E combines large-scale logic capacity, substantial embedded memory, and a high I/O count in a compact 1152-FCBGA surface-mount package. Its electrical and thermal specifications—970 mV to 1.08 V supply and an extended 0 °C to 100 °C operating range—make it suitable for demanding digital designs that require on-chip resources and dense connectivity.

This device is well suited for system designers and procurement teams seeking a single-FPGA solution to consolidate complex logic, reduce board-level BOM, and support memory-intensive processing with ample I/O resources.

Request a quote or submit a purchasing inquiry today to learn more about availability and lead times for the MPF300T-FCG1152E.