MPF300T-FCG784E

The MPF300T-FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density programmable logic fabric with 300,000 logic elements and approximately 21.09 Mbits of embedded memory, intended for designs that require substantial on-chip logic and memory resources.

Packaged in a 784‑BBGA / 784‑FCBGA (29×29) surface-mount package and rated for extended-grade operation, this device is suited to applications that require a large I/O count, compact packaging, and low-voltage core operation.

Key Features

• Core Logic 300,000 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA.
• I/O Capacity 388 general-purpose I/O pins to support diverse interfacing and system integration needs.
• Power Core voltage supply specified from 970 mV to 1.08 V for low-voltage operation.
• Package & Mounting 784‑BBGA, FCBGA package (supplier package: 784‑FCBGA, 29×29) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Extended-grade device with an operating temperature range of 0°C to 100°C.
• Compliance RoHS‑compliant.

Typical Applications

• High-density logic implementations — Use where large amounts of programmable logic and embedded memory are required to implement complex algorithms and datapaths.
• Custom I/O and protocol bridging — Leverage the 388 I/Os for flexible interfacing between subsystems or custom protocol adaptation.
• Embedded compute and buffering — On-chip RAM supports local buffering and lookup operations within embedded processing pipelines.

Unique Advantages

• High logic capacity: 300,000 logic elements enable implementation of sizable digital systems without external programmable logic.
• Significant on-chip memory: Approximately 21.09 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O count: 388 I/Os simplify board-level integration and connectivity to peripherals and subsystems.
• Compact BGA packaging: 784‑FCBGA (29×29) surface-mount package balances high pin count with a small PCB footprint.
• Extended operating range: 0°C to 100°C grade provides suitability for designs requiring extended-temperature components.
• Low-voltage core operation: 970 mV to 1.08 V supply window supports low-power core designs and modern power architectures.

Why Choose MPF300T-FCG784E?

The MPF300T-FCG784E combines a large programmable fabric, substantial embedded memory, and a high I/O count in a compact 784‑FCBGA surface-mount package. Its extended-grade temperature rating and RoHS compliance make it a practical choice for designers seeking a high-density FPGA solution with clear electrical and mechanical specifications.

This device is well suited for development teams and procurement groups targeting designs that require significant on-chip resources, flexible I/O, and a compact package form factor, offering scalability and integration benefits within the PolarFire FPGA family.

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