MPF300T-FCSG536E

IC FPGA 300 I/O 536CSPBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 300 21094400 300000 536-LFBGA, CSPBGA

Quantity 899 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeExtendedOperating Temperature0°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O300Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75000Number of Logic Elements/Cells300000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits21094400

Overview of MPF300T-FCSG536E – PolarFire™ Field Programmable Gate Array (FPGA) IC

The MPF300T-FCSG536E is a PolarFire™ field programmable gate array (FPGA) from Microchip Technology, offering a high-density programmable fabric for complex digital designs. It combines a large logic capacity with substantial on-chip memory and a broad I/O count to support designs that require significant integration within a single surface-mount package.

Key architectural attributes include 300,000 logic elements, approximately 21.09 Mbits of embedded RAM, and 300 I/O pins, making the device suitable for applications that need large logic capacity, significant embedded memory, and substantial external connectivity while operating within an extended-grade thermal range.

Key Features

  • Core Density — 300,000 logic elements provide substantial programmable logic resources for complex function implementation and high integration.
  • Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
  • I/O Resources — 300 I/O pins to enable broad interfacing options with external devices and subsystems.
  • Power Domain — Core voltage supply range of 0.97 V to 1.08 V to match platform power requirements.
  • Package & Mounting — Available in a 536-LFBGA (536-CSPBGA, 16×16) surface-mount package for compact board-level integration.
  • Operating Conditions & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant.

Unique Advantages

  • High logic capacity: 300,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
  • Substantial embedded memory: Approximately 21.09 Mbits of on-chip RAM reduces dependence on external memory for many buffered and stateful operations.
  • Extensive I/O: 300 I/Os provide flexible connectivity for interfacing with sensors, peripherals, and system buses.
  • Compact surface-mount package: 536-LFBGA (16×16 CSPBGA) supports high-density board designs while keeping a small footprint.
  • Extended temperature capability: 0 °C to 100 °C operating range suits designs requiring higher-than-commercial temperature tolerance within the specified limits.
  • Regulatory compliance: RoHS compliance supports environmentally driven procurement and manufacturing requirements.

Why Choose MPF300T-FCSG536E?

MPF300T-FCSG536E positions itself as a high-density PolarFire™ FPGA option from Microchip Technology, delivering a combination of large logic resources, significant embedded RAM, and a substantial I/O count in a compact surface-mount package. Its extended-grade temperature range and RoHS compliance make it appropriate for designs that demand robustness within the specified thermal limits.

This device is well suited for customers and design teams aiming to integrate complex digital functions, on-chip memory, and broad connectivity into a single FPGA-based solution while benefiting from Microchip’s portfolio and manufacturing traceability.

Request a quote or submit an inquiry to begin procurement or to get pricing and availability information for the MPF300T-FCSG536E.

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