MPF300T-FCG784NE

POLARFIRE MID-RANGE FPGA, 300KLE
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 388 21600666 300000 784-BBGA, FCBGA

Quantity 1,376 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O388Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs75000Number of Logic Elements/Cells300000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits21600666

Overview of MPF300T-FCG784NE – PolarFire™ FPGA, 300,000 Logic Elements, 784-FCBGA

The MPF300T-FCG784NE is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering 300,000 logic elements and approximately 21.6 Mbits of embedded memory. The device provides 388 user I/Os in a 784-ball FCBGA package (29 × 29 mm) and is supplied as a surface-mount component.

This part targets designs that require substantive programmable logic capacity combined with ample on-chip RAM and a high I/O count, while operating from a core supply between 0.97 V and 1.08 V and within an extended commercial temperature range (0 °C to 100 °C).

Key Features

  • Logic Capacity — 300,000 logic elements and 75,000 CLBs provide substantial programmable fabric for complex designs.
  • Embedded Memory — Approximately 21.6 Mbits of on-chip RAM to support buffering, packet handling, and intermediate data storage.
  • I/O Density — 388 I/O pins to enable wide external connectivity and system interfacing.
  • Package — 784-BBGA / 784-FCBGA surface-mount package (29 × 29 mm) for high-pin-count board designs.
  • Power Supply — Core voltage range from 0.97 V to 1.08 V for the device core supply requirements.
  • Temperature Grade — Extended commercial grade with an operating junction range of 0 °C to 100 °C.
  • Mounting & Compliance — Surface-mount component, RoHS compliant to meet standard environmental requirements.

Unique Advantages

  • Substantial Programmable Fabric: 300,000 logic elements and 75,000 CLBs enable integration of complex logic, custom datapaths, and state machines on-chip.
  • Generous On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces external memory requirements for many buffering and processing tasks.
  • High External Connectivity: 388 I/Os support broad peripheral and bus interfacing without extensive external multiplexing.
  • Compact High-Pin Package: 784-ball FCBGA (29 × 29 mm) balances high I/O count with a compact PCB footprint for dense designs.
  • Defined Operating Envelope: Clear core voltage (0.97–1.08 V) and extended temperature rating (0 °C–100 °C) make system-level power and thermal planning straightforward.
  • RoHS Compliant: Meets common environmental compliance requirements for commercial products.

Why Choose MPF300T-FCG784NE?

The MPF300T-FCG784NE positions itself as a high-capacity PolarFire FPGA option for designs that need a large logic fabric, significant on-chip memory, and a high I/O count in a 784-ball FCBGA package. Its extended commercial temperature rating and defined core voltage range simplify integration into commercial and industrial-adjacent systems where these electrical and thermal constraints are appropriate.

With detailed datasheet documentation available for the PolarFire family, this device is suited to engineering teams seeking a well-specified, high-density FPGA platform that can consolidate logic and memory resources while providing predictable electrical and thermal parameters.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for MPF300T-FCG784NE.

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