MPF300T-FCG784NE
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 388 21600666 300000 784-BBGA, FCBGA |
|---|---|
| Quantity | 1,376 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 388 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 21600666 |
Overview of MPF300T-FCG784NE – PolarFire™ FPGA, 300,000 Logic Elements, 784-FCBGA
The MPF300T-FCG784NE is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering 300,000 logic elements and approximately 21.6 Mbits of embedded memory. The device provides 388 user I/Os in a 784-ball FCBGA package (29 × 29 mm) and is supplied as a surface-mount component.
This part targets designs that require substantive programmable logic capacity combined with ample on-chip RAM and a high I/O count, while operating from a core supply between 0.97 V and 1.08 V and within an extended commercial temperature range (0 °C to 100 °C).
Key Features
- Logic Capacity — 300,000 logic elements and 75,000 CLBs provide substantial programmable fabric for complex designs.
- Embedded Memory — Approximately 21.6 Mbits of on-chip RAM to support buffering, packet handling, and intermediate data storage.
- I/O Density — 388 I/O pins to enable wide external connectivity and system interfacing.
- Package — 784-BBGA / 784-FCBGA surface-mount package (29 × 29 mm) for high-pin-count board designs.
- Power Supply — Core voltage range from 0.97 V to 1.08 V for the device core supply requirements.
- Temperature Grade — Extended commercial grade with an operating junction range of 0 °C to 100 °C.
- Mounting & Compliance — Surface-mount component, RoHS compliant to meet standard environmental requirements.
Unique Advantages
- Substantial Programmable Fabric: 300,000 logic elements and 75,000 CLBs enable integration of complex logic, custom datapaths, and state machines on-chip.
- Generous On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces external memory requirements for many buffering and processing tasks.
- High External Connectivity: 388 I/Os support broad peripheral and bus interfacing without extensive external multiplexing.
- Compact High-Pin Package: 784-ball FCBGA (29 × 29 mm) balances high I/O count with a compact PCB footprint for dense designs.
- Defined Operating Envelope: Clear core voltage (0.97–1.08 V) and extended temperature rating (0 °C–100 °C) make system-level power and thermal planning straightforward.
- RoHS Compliant: Meets common environmental compliance requirements for commercial products.
Why Choose MPF300T-FCG784NE?
The MPF300T-FCG784NE positions itself as a high-capacity PolarFire FPGA option for designs that need a large logic fabric, significant on-chip memory, and a high I/O count in a 784-ball FCBGA package. Its extended commercial temperature rating and defined core voltage range simplify integration into commercial and industrial-adjacent systems where these electrical and thermal constraints are appropriate.
With detailed datasheet documentation available for the PolarFire family, this device is suited to engineering teams seeking a well-specified, high-density FPGA platform that can consolidate logic and memory resources while providing predictable electrical and thermal parameters.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for MPF300T-FCG784NE.

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