MPF300T-FCG484E

IC FPGA 244 I/O 484FCBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 244 21094400 300000 484-BBGA, FCBGA

Quantity 861 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O244Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75000Number of Logic Elements/Cells300000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits21094400

Overview of MPF300T-FCG484E – PolarFire™ Field Programmable Gate Array (FPGA) IC 244 21094400 300000 484-BBGA, FCBGA

The MPF300T-FCG484E is a PolarFire™ Field Programmable Gate Array from Microchip Technology providing high-capacity programmable logic with on-chip embedded memory. It integrates up to 300,000 logic elements and approximately 21.09 Mbits of embedded memory in a compact 484-FCBGA (23×23) package.

Designed for designs that require substantial logic resources, significant embedded RAM, and a broad I/O count, this device supports operation from a core voltage range of 0.970 V to 1.08 V and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount 484-BBGA/FCBGA package with 244 I/O pins.

Key Features

  • Core Logic — 300,000 logic elements provide extensive programmable logic capacity for complex digital designs.
  • Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support large buffering, state storage, and data processing functions.
  • I/O and Package — 244 general-purpose I/O pins in a 484-FCBGA (23×23) package; surface-mount mounting for compact board integration.
  • Power — Core supply range of 0.970 V to 1.08 V, allowing designs to target the specified low-voltage operating window.
  • Thermal and Grade — Extended grade device rated for an operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant for environmental and regulatory alignment in manufacturable designs.

Unique Advantages

  • High logic capacity: 300,000 logic elements permit implementation of large-scale digital functions within a single FPGA package.
  • Substantial on-chip memory: Approximately 21.09 Mbits of embedded RAM reduces the need for external memory in many applications.
  • Generous I/O count: 244 I/O pins enable extensive peripheral and bus interfacing without complex board-level multiplexing.
  • Compact, surface-mount package: 484-FCBGA (23×23) package supports dense PCB layouts and automated assembly processes.
  • Low-voltage core operation: Core supply range of 0.970 V to 1.08 V accommodates designs targeting low-voltage FPGA cores.
  • Extended temperature capability: Rated for 0 °C to 100 °C operation for applications within that thermal envelope.

Why Choose MPF300T-FCG484E?

The MPF300T-FCG484E delivers a balance of high logic density, significant embedded memory, and broad I/O capability in a compact FCBGA package from Microchip Technology. Its specification set—300,000 logic elements, approximately 21.09 Mbits of RAM, 244 I/Os, and a 484-FCBGA (23×23) surface-mount package—makes it well suited to designs that require high integration and scalable logic resources while maintaining a controlled thermal and power envelope.

This PolarFire™ FPGA is a fit for development teams and procurement groups seeking a programmable device that combines large on-chip resources with RoHS compliance and an extended operating temperature range, enabling robust, compact designs that consolidate functionality on a single FPGA device.

Request a quote or contact sales to discuss pricing, availability, and ordering for the MPF300T-FCG484E.

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