MPF300T-FCG784NI

The MPF300T-FCG784NI is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for applications requiring substantial logic density and on-chip memory in a compact FCBGA package. This industrial-grade device integrates approximately 300,000 logic elements and about 21.6 Mbits of embedded memory, together with a high I/O count and a wide operating temperature range to support reliable operation in demanding environments.

Key Features

• Core Logic Approximately 300,000 logic elements provide substantial programmable logic capacity for complex digital functions and custom accelerators.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM for buffering, packet processing, and data storage in logic-centric designs.
• I/O Density 388 device I/Os enable high connectivity for multi-channel interfaces, sensor arrays, or board-level integration with numerous peripherals.
• Power and Voltage Core supply range from 0.970 V to 1.080 V supports the device's internal power requirements and system-level power planning.
• Package and Mounting 784-FCBGA (29 × 29) package in a surface-mount form factor provides a compact footprint for space-constrained boards.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Regulatory Compliance RoHS-compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• Industrial Systems — Industrial control and automation designs that require robust operation across a wide temperature range and significant programmable logic capacity.
• High-Density I/O Solutions — Board-level designs needing large numbers of I/Os for interfacing multiple peripherals, sensors, or high-channel-count systems.
• Memory-Centric Logic — Data buffering, packet processing, and on-chip data handling where substantial embedded RAM combined with programmable logic is required.

Unique Advantages

• High logic density: Approximately 300,000 logic elements enable complex designs and consolidation of functions into a single device, reducing component count.
• Significant on-chip memory: Around 21.6 Mbits of embedded RAM supports local data storage and low-latency processing without external memory.
• Extensive I/O: 388 I/Os allow flexible system integration and high connectivity for multi-channel or multi-peripheral applications.
• Industrial-grade thermal performance: Operation from −40 °C to 100 °C provides robustness for industrial and harsh-environment deployments.
• Compact FCBGA package: The 784-FCBGA (29 × 29) surface-mount package helps save board space while supporting high pin count.
• Manufacturer support: Backed by Microchip Technology, offering continuity and supply-chain visibility for system designers.

Why Choose MPF300T-FCG784NI?

The MPF300T-FCG784NI balances large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact industrial-grade FCBGA package. Its combination of approximately 300,000 logic elements, roughly 21.6 Mbits of on-chip RAM, and operation from −40 °C to 100 °C makes it well suited for designers building systems that require both density and reliability.

Designed and supplied by Microchip Technology, this PolarFire™ FPGA option is appropriate for applications where integration, thermal robustness, and scalable programmable resources are key considerations for long-term product designs.

Request a quote or submit a sales inquiry to evaluate MPF300T-FCG784NI for your next project.