MPF300T-FCSG536T2

The MPF300T-FCSG536T2 is a PolarFire™ Field Programmable Gate Array (FPGA) IC providing a large pool of configurable logic and embedded memory in a compact 536-LFBGA package. With 300,000 logic elements and approximately 21.6 Mbits of embedded memory, this device is built for designs that require high logic capacity, substantial on-chip RAM, and a dense I/O count.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, the device is specified for automotive applications and other systems that demand extended temperature operation and automotive-grade qualification. The device operates from a core supply range of 0.970 V to 1.08 V and is provided in a surface-mount 536‑BGA (16×16) package.

Key Features

• Core Logic  300,000 logic elements provide a high-capacity fabric for complex digital implementations and custom logic functions.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage without external SRAM.
• I/O Density  300 I/O pins support a variety of high-pin-count interfacing requirements and system-level integration.
• Power  Core voltage supply defined between 0.970 V and 1.08 V for predictable power planning and board-level supply design.
• Package and Mounting  536‑LFBGA (supplier package: 536‑BGA 16×16) in a surface-mount form factor suitable for compact PCB layouts.
• Automotive Qualification & Reliability  AEC‑Q100 qualification and automotive grade listing indicate suitability for automotive electronic systems requiring industry qualification.
• Temperature Range  Rated for operation from −40 °C to 125 °C to meet broad environmental and thermal requirements.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Automotive electronic subsystems  AEC‑Q100 qualification and extended temperature rating make the device appropriate for in-vehicle digital logic, control, and subsystem tasks.
• Embedded systems with large logic requirements  High logic element count and substantial on-chip RAM support complex control, signal processing, and protocol implementations without immediate external memory dependence.
• High-density I/O designs  300 I/Os accommodate multi-channel interfaces, sensor arrays, and mixed-signal front-end connectivity that require many signal lines.

Unique Advantages

• High logic capacity: 300,000 logic elements enable consolidation of multiple digital functions into a single programmable device, reducing board-level component count.
• Significant embedded memory: Approximately 21.6 Mbits of on-chip RAM lowers dependence on external memory for buffering and temporary storage, simplifying BOM and layout.
• Automotive-grade qualification: AEC‑Q100 qualification provides documented suitability for automotive electronic designs that require industry qualification.
• Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally demanding environments.
• Compact, high-pin-count package: The 536‑LFBGA (536‑BGA 16×16) surface-mount package offers a balance of I/O density and board-space efficiency for compact designs.
• Defined low-voltage core: A narrow core supply range (0.970 V–1.08 V) enables precise power-system design and consistency across production.

Why Choose MPF300T-FCSG536T2?

The MPF300T-FCSG536T2 positions itself as a high-capacity, automotive-qualified FPGA option for designs that need substantial programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. Its AEC‑Q100 qualification, extended temperature rating, and RoHS compliance make it suitable for automotive electronic subsystems and other applications demanding qualified components.

For engineers seeking a scalable, reliable programmable device with clear electrical and mechanical specifications—300,000 logic elements, ~21.6 Mbits of RAM, 300 I/Os, and a 536‑LFBGA footprint—this PolarFire™ FPGA delivers explicit capacity and qualification to support long-term product development and deployment.

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