MPF300TL-FCG1152E

The MPF300TL-FCG1152E is a PolarFire™ field programmable gate array (FPGA) IC designed for complex, high-density designs. It provides approximately 300,000 logic elements, roughly 21.09 Mbits of embedded memory, and up to 512 I/O pins in a 1152-ball FCBGA package.

With a low-voltage core range of 970 mV to 1.08 V and an extended-grade operating window from 0 °C to 100 °C, this device targets applications that require significant on-chip logic and memory capacity in a surface-mount FCBGA form factor.

Key Features

• Core capacity — Approximately 300,000 logic elements to support large-scale programmable logic implementations.
• Embedded memory — Approximately 21.09 Mbits of on-chip RAM for buffering, state storage, and algorithm acceleration.
• I/O — 512 available I/O pins to accommodate wide interfaces, parallel buses, and multi-channel connectivity.
• Power — Core supply range of 970 mV to 1.08 V to match low-voltage system rails.
• Package and mounting — 1152-ball FCBGA (35×35 mm) surface-mount package for compact board-level integration.
• Operating range and grade — Extended grade device rated for 0 °C to 100 °C operation.
• RoHS compliant — Meets RoHS environmental requirements for lead-free assembly.

Unique Advantages

• High integration density: Large logic element count and substantial embedded RAM reduce the need for external components and simplify system architecture.
• Wide I/O capability: 512 I/O pins enable designs with multiple interfaces, high-channel counts, or wide data buses without external I/O expanders.
• Compact FCBGA package: 1152-ball FCBGA (35×35) balances pin density with a compact footprint for space-constrained PCBs.
• Low-voltage core support: Core supply range from 970 mV to 1.08 V aligns with modern low-power system rails.
• Extended-grade reliability: Rated for 0 °C to 100 °C operation to support applications that require above-commercial temperature tolerance.
• RoHS compliance: Facilitates lead-free manufacturing and simplifies regulatory considerations.

Why Choose MPF300TL-FCG1152E?

The MPF300TL-FCG1152E positions itself as a high-density, highly integrated PolarFire™ FPGA option for designs that need substantial logic resources, on-chip memory, and a large number of I/O in a compact surface-mount FCBGA package. Its low-voltage core range and extended-grade temperature rating make it suitable for a broad set of embedded and system-level applications that require robustness without external memory or I/O proliferation.

Engineers and procurement teams seeking a scalable FPGA solution with verified capacity numbers—approximately 300,000 logic elements, ~21.09 Mbits embedded RAM, and 512 I/O—will find this device aligned with demanding board-level integration goals while maintaining RoHS compliance.

Request a quote or submit an inquiry to evaluate MPF300TL-FCG1152E for your next design and receive pricing and availability information.