MPF300TL-FCG484I

The MPF300TL-FCG484I is a PolarFire™ field programmable gate array (FPGA) in a 484-ball FCBGA package. It provides a high-density programmable fabric with a large number of logic elements, significant on-chip RAM, and a substantial I/O count for industrial-grade embedded designs.

Designed for low-voltage operation and extended temperature support, this device targets applications that require high logic capacity, embedded memory, and robust thermal performance within a compact surface-mount package.

Key Features

• Logic Capacity  300,000 logic elements and 75,000 CLBs provide substantial programmable resources for complex logic and control functions.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage within the FPGA fabric.
• I/O Density  244 user I/Os for broad peripheral interfacing and multi-channel connectivity.
• Power  Low-voltage core supply range from 970 mV to 1.08 V to meet designs with constrained power budgets.
• Package and Mounting  484-ball FCBGA (484-BBGA) surface-mount package (23 × 23 mm supplier package) for high-density board implementations.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control Systems  Industrial-temperature operation and robust I/O count support factory automation, motion control, and programmable logic applications.
• High-Density Logic Implementations  The combination of 300,000 logic elements and 75,000 CLBs enables complex protocol handling, signal processing, and custom compute blocks.
• On-Chip Data Buffering  Approximately 21.09 Mbits of embedded memory allows local buffering, packet queues, and memory-intensive state machines.
• Multi-Peripheral Systems  244 I/Os provide connectivity for multiple interfaces, sensors, and external devices within a single FPGA solution.

Unique Advantages

• High Logic Integration: 300,000 logic elements and 75,000 CLBs reduce the need for external glue logic and enable consolidated system functionality on a single device.
• Substantial Embedded Memory: Approximately 21.09 Mbits of on-chip RAM supports data-path buffering and reduces dependency on external memory components.
• Compact, High-Pin Package: 484-FCBGA packaging delivers a high I/O count in a compact surface-mount footprint for space-constrained boards.
• Low-Voltage Core: Core supply from 970 mV to 1.08 V helps meet designs with strict power management and low-voltage architectures.
• Industrial Reliability: Rated for operation from -40 °C to 100 °C, the device supports deployment in temperature-challenging industrial environments.
• Standards-Conscious Supply Chain: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose MPF300TL-FCG484I?

The MPF300TL-FCG484I positions itself as a high-density, industrial-grade FPGA option that combines a large logic fabric, significant on-chip memory, and a high I/O count in a compact 484-ball FCBGA package. Its low-voltage core and extended temperature rating make it well suited for embedded systems where power efficiency and environmental robustness matter.

Choose this device when your design requires consolidated programmable logic, substantial embedded RAM, and a broad set of I/Os in a surface-mount form factor, backed by RoHS compliance for manufacturing alignment.

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