MPF300TL-FCSG536I

The MPF300TL-FCSG536I is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology optimized for designs that require high logic capacity and substantial on-chip memory. It provides approximately 300,000 logic elements and roughly 21.09 Mbits of embedded memory in a compact 536-pin CSPBGA/LFBGA package, delivering a balance of integration density, I/O count and industrial-class operating range for demanding embedded systems.

Key Features

• Core Logic  Approximately 300,000 logic elements to implement large-scale custom digital functions and complex control logic.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for buffering, frame storage and intermediate data processing.
• I/O Density  300 available I/O pins to support multiple interfaces and high pin-count system connections.
• Power  Core supply range of 970 mV to 1.08 V to match modern low-voltage system power rails.
• Package & Mounting  536-LFBGA (536-CSPBGA, 16×16) package in a surface-mount form factor for compact PCB integration.
• Environmental & Reliability  Industrial-grade device with an operating temperature range of −40 °C to 100 °C, suitable for thermally challenging environments.
• Standards Compliance  RoHS-compliant manufacturing status.

Typical Applications

• Custom digital logic and control  Implementation of bespoke digital processing, protocol engines and control algorithms using large-scale programmable logic.
• Prototyping and system integration  Rapid hardware prototyping and consolidation of multiple functions into a single programmable device to reduce BOM and board complexity.
• I/O consolidation and interface bridging  Use of the 300 I/Os to aggregate signals, bridge disparate interfaces and manage high pin-count connectivity.
• Industrial systems  Deployment in equipment that benefits from extended temperature operation and robust surface-mount packaging.

Unique Advantages

• High integration density: The combination of ~300,000 logic elements and ~21.09 Mbits of embedded memory enables complex designs to be implemented on a single device, reducing external components.
• Extensive I/O capability: 300 I/Os provide the flexibility to support multiple interfaces and peripherals without external multiplexing.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in thermally demanding environments.
• Compact, surface-mount package: 536-LFBGA/CSPBGA (16×16) package supports high-density PCB layouts while maintaining manufacturability.
• Low-voltage core: Core supply range of 970 mV to 1.08 V aligns with modern low-voltage system architectures to help optimize power delivery.
• RoHS-compliant: Manufactured to meet RoHS requirements for material compliance.

Why Choose MPF300TL-FCSG536I?

The MPF300TL-FCSG536I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, meaningful on-chip memory and a high I/O count in a compact package. Its extended operating temperature window and surface-mount 536-pin CSPBGA/LFBGA package make it suitable for embedded systems where board space, connectivity and reliability matter.

This device is well suited to engineers and teams building scalable, integrated digital solutions who need a balance of logic density, memory and I/O without sacrificing thermal margin. The PolarFire FPGA’s specification set supports long-term design use where robustness and programmable flexibility are priorities.

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