MPF300TL-FCSG536E

The MPF300TL-FCSG536E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology delivering 300,000 logic elements and approximately 21 Mbits of on-chip RAM. It is designed for board-level FPGA designs that require substantial logic capacity, embedded memory, and a broad set of I/O in a compact 536-ball LFBGA/CSPBGA package.

With a 300-pin I/O count, low-voltage core operation and extended-grade temperature support, this device targets applications that need high integration density, predictable operating conditions, and surface-mount packaging for space-efficient assemblies.

Key Features

• Core Logic — 300,000 logic elements to implement complex digital functions and high-density logic designs.
• Embedded Memory — Total on-chip RAM of 21,094,400 bits (approximately 21 Mbits) to support buffering, data storage and pipelined processing without external memory.
• I/O Capacity — 300 user I/O pins provide flexible interfacing to external peripherals, sensors and high-speed transceivers.
• Power and Voltage — Core operating voltage range from 0.970 V to 1.080 V for low-voltage power domains.
• Package and Mounting — 536-LFBGA / 536-CSPBGA (16×16) package in a surface-mount form factor for compact PCB layouts.
• Operating Range and Grade — Extended-grade device rated for 0 °C to 100 °C, suitable for temperature-controlled environments.
• Compliance — RoHS compliant, meeting common environmental disposal and material standards.

Typical Applications

• High-density digital processing — Implement complex logic, custom datapaths and control logic using large logic element counts and on-chip memory.
• Embedded buffering and packet processing — Use the approximately 21 Mbits of embedded RAM for frame buffering, FIFOs and low-latency packet handling.
• I/O-rich interface hubs — Leverage 300 I/O pins to aggregate multiple peripheral connections and protocol bridges on a single FPGA.
• Compact board-level FPGA solutions — Deploy in space-constrained PCBs using the 536-ball LFBGA/CSPBGA surface-mount package for small footprint designs.

Unique Advantages

• High logic capacity: 300,000 logic elements enable implementation of large-scale digital systems without multiple devices.
• Substantial embedded memory: Approximately 21 Mbits of on-chip RAM reduces dependence on external memory and simplifies board design.
• Generous I/O count: 300 I/Os allow flexible connection options and partitioning of interfaces across the FPGA fabric.
• Compact, board-friendly package: 536-LFBGA/CSPBGA in a 16×16 package supports high-density PCB assembly and surface-mount manufacturing.
• Low-voltage core: Core operation from 0.970 V to 1.080 V helps optimize power distribution in multi-voltage designs.
• Extended operating temperature: Rated 0 °C to 100 °C for deployments in temperature-controlled or commercial environments.

Why Choose MPF300TL-FCSG536E?

The MPF300TL-FCSG536E positions itself as a high-capacity PolarFire FPGA option for designers who need a balance of dense logic, meaningful on-chip RAM and extensive I/O in a compact surface-mount package. Its extended-grade temperature range and RoHS compliance make it suited to controlled-environment applications where integration density and predictable operation are priorities.

Backed by Microchip Technology, this device offers a scalable hardware building block for teams developing embedded systems, communications interfaces, and logic-intensive board-level solutions that benefit from significant on-chip resources and a small board footprint.

Request a quote or submit an inquiry to obtain pricing and availability for the MPF300TL-FCSG536E. Our team can provide lead-time and ordering information to support your design schedule.