MPF300TL-FCG784I

The MPF300TL-FCG784I is a PolarFire™ field-programmable gate array (FPGA) IC designed for industrial-grade embedded designs. It delivers a high-density programmable fabric with 300,000 logic elements, substantial on-chip memory, and a large I/O count for complex interfacing and system integration.

With a specified operating range of –40 °C to 100 °C and RoHS compliance, this device targets industrial applications that require scalable logic capacity, significant embedded memory, and robust I/O in a compact FCBGA package.

Key Features

• Core Capacity 300,000 logic elements provide a large programmable fabric for complex logic implementation.
• Configurable Logic Blocks 75,000 CLBs for structured logic partitioning and resource organization.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support memory-intensive functions and buffering.
• I/O Density 388 I/Os to support extensive peripheral connectivity and multi-channel interfaces.
• Power Supply Core voltage range from 970 mV to 1.08 V, enabling defined power rail planning for the FPGA core.
• Package and Mounting 784-BBGA / FCBGA package, supplier device package 784-FCBGA (29x29), surface-mount mounting type for compact board integration.
• Industrial Temperature Range Rated to operate from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature range and high logic capacity enable complex control logic and real-time processing for factory automation and machine control.
• High-Density I/O Interfaces — 388 I/Os support multi-channel sensor interfacing, communications front-ends, and custom I/O aggregation.
• Memory-Intensive FPGA Functions — Approximately 21.09 Mbits of embedded memory make the device suitable for buffering, packet processing, and on-chip data storage tasks.

Unique Advantages

• High Logic Capacity: 300,000 logic elements provide ample resources for large finite-state machines, datapaths, and custom accelerators.
• Large CLB Count: 75,000 CLBs support structured logic partitioning and scalable design implementation.
• Significant On-Chip Memory: Approximately 21.09 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Extensive I/O: 388 I/Os simplify integration with multiple peripherals and interface standards.
• Industrial-Grade Operation: Rated from –40 °C to 100 °C for deployment in demanding industrial environments.
• Compact FCBGA Package: 784-FCBGA (29x29) surface-mount package enables high-density board layouts while maintaining a standardized package format.

Why Choose MPF300TL-FCG784I?

The MPF300TL-FCG784I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, embedded memory, and abundant I/O in a compact FCBGA package. Its combination of 300,000 logic elements, approximately 21.09 Mbits of on-chip RAM, and 388 I/Os addresses complex integration needs while supporting operation across a wide industrial temperature range.

This device is suited to engineering teams and procurement specialists designing industrial systems, high-density I/O solutions, or memory-demanding FPGA implementations that value predictable supply voltages and RoHS-compliant components.

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