MPF300TLS-FCG1152I

The MPF300TLS-FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, provided in a 1152-FCBGA (35×35) surface-mount package. It delivers a combination of high logic capacity, substantial embedded memory, and a large I/O count for industrial-grade designs.

Designed for applications that require reconfigurable logic at industrial temperatures, this device offers a defined core voltage range and RoHS compliance to meet environmental requirements.

Key Features

• Logic Capacity  300,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 21 Mbits of on-chip RAM (21,094,400 bits) to support buffering, state storage, and local data processing.
• I/O  512 I/O pins to support high-pin-count interfaces and parallel connectivity in embedded systems.
• Power  Core supply voltage range of 0.97 V to 1.08 V to match system power rails and enable predictable power budgeting.
• Package & Mounting  1152-FCBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Operational Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance  RoHS-compliant construction to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control  Use in industrial systems that require robust operation across −40 °C to 100 °C and significant reconfigurable logic.
• High-Density I/O Systems  Suitable for designs needing up to 512 I/Os for parallel interfaces, sensor arrays, or multi-channel data paths.
• Embedded Acceleration and Processing  Provides substantial logic and on-chip memory to implement custom accelerators, data-path processing, and protocol handling.

Unique Advantages

• High Logic Integration: 300,000 logic elements allow consolidation of complex functions into a single device, reducing BOM and board complexity.
• Significant On-Chip Memory: Approximately 21 Mbits of embedded RAM supports buffering and local data processing without relying on external memory.
• Large I/O Count: 512 I/Os enable broad connectivity options for parallel interfaces, multi-lane communications, and peripheral expansion.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation, meeting the thermal requirements of demanding environments.
• Compact FCBGA Package: 1152-FCBGA (35×35) surface-mount package supports high-density board integration while preserving signal routing flexibility.
• Controlled Core Power: Core voltage specification from 0.97 V to 1.08 V helps with power planning and compatibility with standard supply rails.

Why Choose MPF300TLS-FCG1152I?

The MPF300TLS-FCG1152I positions itself as a high-density PolarFire FPGA offering a balanced combination of logic resources, embedded memory, and I/O capacity in an industrial-rated package. Its specifications make it well suited for engineers who need reconfigurable digital logic with a focus on integration and reliable operation across a wide temperature range.

Manufactured by Microchip Technology and provided in a compact 1152-FCBGA surface-mount package, this device supports designs that require substantial on-chip resources and robust environmental performance while maintaining compliance with common RoHS standards.

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