MPF300T-1FCSG536E

The MPF300T-1FCSG536E is a PolarFire™ FPGA IC offering a high-capacity programmable fabric with 300,000 logic elements and 75,000 LABs. It pairs a substantial on-chip memory resource—approximately 21.09 Mbits of embedded memory—with up to 300 I/O to address complex digital designs that require dense logic, significant memory, and broad connectivity.

Packaged in a 536-pin LFBGA/CSPBGA format and rated for extended-grade operation, this device is aimed at applications where logic density, I/O count, and a compact surface-mount package are key design drivers.

Key Features

• Logic Capacity  300,000 logic elements and 75,000 LABs provide a large programmable fabric for complex logic implementations.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate data storage within FPGA designs.
• I/O  Up to 300 I/O pins to support multiple interfaces and external device connectivity in a single device.
• Power  Core voltage supply range of 0.970 V to 1.080 V for the FPGA core domain.
• Package & Mounting  536-LFBGA / CSPBGA package with a supplier device package of 536-CSPBGA (16×16); surface-mount mounting type for compact PCB implementation.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Networking & Communications  Use the device’s high logic capacity and 300 I/O to implement packet processing, protocol bridging, or custom interface logic.
• Signal Processing  Leverage the combination of abundant logic elements and on-chip RAM for DSP pipelines, buffering, and real-time data manipulation.
• Embedded Systems & Prototyping  Compact 536-pin surface-mount packaging and extensive logic resources make it suitable for evaluating and integrating complex custom logic in prototypes and embedded platforms.
• Industrial Control  Extended-grade temperature range and high I/O count support control systems that require substantial logic and multiple sensor/actuator interfaces.

Unique Advantages

• High logic density: 300,000 logic elements enable implementation of large, complex designs without external logic expansion.
• Substantial embedded memory: Approximately 21.09 Mbits of on-chip RAM reduces dependence on external memory for intermediate storage and buffering.
• Generous I/O availability: 300 I/O pins simplify integration of multiple peripherals and high-pin-count interfaces.
• Compact, assembly-ready package: 536-LFBGA / 536-CSPBGA (16×16) surface-mount package supports high-density board designs and automated assembly.
• Controlled power domain: Core voltage range of 0.970–1.080 V allows predictable integration into regulated power architectures.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead-free assemblies.

Why Choose MPF300T-1FCSG536E?

The MPF300T-1FCSG536E positions itself where high logic capacity, significant embedded memory, and substantial I/O converge in a compact, surface-mount FPGA. Its extended-grade temperature range and RoHS compliance make it suitable for a range of commercial and industrial-adjacent applications that require reliable, dense programmable logic in a 536-pin package.

Designers seeking to consolidate complex digital functions, implement sizable DSP or packet-processing blocks, or prototype feature-rich embedded systems will find the combination of 300,000 logic elements, approximately 21.09 Mbits of on-chip RAM, and 300 I/O particularly valuable for reducing board-level complexity and component count.

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