MPF300T-1FCG784E

The MPF300T-1FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC providing high-density programmable logic and on-chip memory in a 784-ball FCBGA package. The device includes 300,000 logic elements organized across 75,000 CLBs, approximately 21.09 Mbits of embedded memory, and 388 I/O pins.

Built for designs that require substantial logic capacity, embedded RAM, and broad I/O connectivity, this surface-mount FPGA operates from a core voltage range of 0.970 V to 1.080 V and is specified for an operating temperature range of 0 °C to 100 °C (Extended grade). The package is supplied as a 784-FCBGA (29×29).

Key Features

• Core Architecture  PolarFire™ FPGA architecture in an IC form factor, delivering programmable logic resources suitable for mid-to-high density designs.
• Logic Capacity  300,000 logic elements organized across 75,000 CLBs to implement complex custom logic and state machines.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for buffering, lookup tables, and embedded data storage.
• I/O Resources  388 I/O pins to support extensive peripheral interfacing and board-level connectivity.
• Power  Core supply voltage range from 0.970 V to 1.080 V for defined power and timing behavior.
• Package & Mounting  784-FCBGA package (29×29) supplied in a surface-mount form factor for compact board integration.
• Temperature & Grade  Extended-grade device specified for operation from 0 °C to 100 °C.
• RoHS Compliance  RoHS-compliant construction to meet environmental and manufacturing lead-free requirements.

Unique Advantages

• High logic integration: 300,000 logic elements provide capacity to consolidate multiple functions into a single FPGA, reducing external components.
• Substantial on-chip memory: Approximately 21.09 Mbits of embedded RAM supports buffering and data handling without immediate need for external memory.
• Extensive I/O count: 388 I/Os enable flexible interfacing with sensors, peripherals, and high-pin-count subsystems.
• Compact board footprint: 784-FCBGA (29×29) surface-mount package balances high pin count with a compact package for dense PCB designs.
• Defined operating window: Core voltage range (0.970 V–1.080 V) and 0 °C–100 °C operating temperature provide clear design constraints for system power and thermal planning.
• Environmental compliance: RoHS status ensures the device meets common lead-free manufacturing requirements.

Why Choose MPF300T-1FCG784E?

The MPF300T-1FCG784E positions itself as a high-density, on-chip memory–rich FPGA in a compact 784-FCBGA footprint. Its combination of 300,000 logic elements, roughly 21.09 Mbits of embedded RAM, and 388 I/Os makes it suitable for designs that require substantial programmable logic, embedded data storage, and broad external connectivity within defined power and thermal limits.

Engineers and procurement teams looking for a PolarFire™ FPGA offering clear electrical and thermal specifications, a high pin count package, and RoHS compliance will find the MPF300T-1FCG784E aligned with those needs and ready for integration into surface-mount PCB assemblies.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the MPF300T-1FCG784E.