MPF300T-1FCG484E

The MPF300T-1FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high logic capacity FPGA fabric for designs requiring substantial programmable logic, on-chip memory, and a broad I/O complement.

Key device attributes include approximately 300,000 logic elements, roughly 21.09 Mbits of embedded memory, 244 I/O pins, a 484-FCBGA (23×23) surface-mount package, and operation over a 970 mV to 1.08 V supply range. The device is specified for extended-grade operation from 0°C to 100°C and is RoHS compliant.

Key Features

• FPGA Core  PolarFire™ Field Programmable Gate Array architecture with approximately 300,000 logic elements to implement complex programmable logic and custom hardware functions.
• Configurable Logic Blocks  High-capacity logic fabric suitable for large-scale logic integration and custom digital designs.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Capacity  244 general-purpose I/O pins to support multiple external interfaces and board-level connectivity.
• Power Supply  Core supply range specified from 970 mV to 1.08 V to match system power domains.
• Package and Mounting  484-FCBGA (23×23) package in a 484-BBGA form factor; surface-mount construction for compact board integration.
• Temperature and Grade  Extended-grade device rated for operation from 0°C to 100°C.
• Environmental Compliance  RoHS compliant construction for regulatory and environmental considerations.

Typical Applications

• High-density logic systems  Implement large custom logic functions and hardware accelerators leveraging the device's 300,000 logic elements.
• Memory-intensive designs  Use the approximately 21.09 Mbits of embedded memory for buffering, packet storage, or state machines.
• Multi-I/O integration  244 I/O pins enable integration of multiple external interfaces, sensors, or peripherals on a single FPGA.

Unique Advantages

• High logic capacity: Approximately 300,000 logic elements provide the density needed to consolidate complex functions into a single device, reducing system BOM.
• Substantial on-chip memory: Approximately 21.09 Mbits of embedded RAM supports data buffering and memory-heavy processing without external memory in some designs.
• Generous I/O count: 244 I/Os allow flexible connectivity and reduce the need for external multiplexing or additional interface chips.
• Compact FCBGA package: 484-FCBGA (23×23) package enables high-density board layouts while supporting surface-mount assembly.
• Extended-grade thermal specification: Rated for 0°C to 100°C operation to match a range of system thermal environments.
• RoHS compliant: Meets common environmental compliance requirements for modern electronic assemblies.

Why Choose MPF300T-1FCG484E?

The MPF300T-1FCG484E positions itself as a high-capacity PolarFire™ FPGA option for designs that require substantial programmable logic, on-chip memory, and a wide I/O complement in a compact FCBGA package. Its specification—approximately 300,000 logic elements, roughly 21.09 Mbits of embedded memory, and 244 I/Os—makes it well suited for consolidating complex digital functions onto a single FPGA device.

As a Microchip Technology PolarFire™ device with extended-grade temperature rating and RoHS compliance, it offers a balance of integration and environmental conformance for engineering teams targeting robust, scalable FPGA-based designs.

Request a quote or submit a pricing and availability inquiry for MPF300T-1FCG484E to evaluate fit for your next design project.