MPF300T-1FCG1152I

The MPF300T-1FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides a high logic capacity and substantial on-chip memory combined with a high I/O count in a compact FCBGA package.

This device is specified for operation over an industrial temperature range and supports low-voltage supply rails, making it suitable for designs that require deterministic, reconfigurable logic resources within a surface-mount form factor.

Key Features

• Core  Field Programmable Gate Array architecture with 300,000 logic elements for large-scale programmable logic integration.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM (21,094,400 bits) to support buffering, look-up tables and data storage within the fabric.
• I/O Density  512 available I/O pins to support multiple external interfaces and high-pin-count system designs.
• Power  Supported core voltage range from 0.970 V to 1.08 V for low-voltage system integration.
• Package & Mounting  1152-FCBGA (35×35) supplier device package (1152-BBGA, FCBGA); surface-mount mounting type for compact PCB implementation.
• Temperature Range  Industrial-grade operating range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Unique Advantages

• High logic capacity: 300,000 logic elements enable complex, high-density programmable designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 21.09 Mbits of embedded RAM reduces dependence on off-chip memory for many buffering and data-path needs.
• High I/O count: 512 I/O pins accommodate multiple interfaces and parallel connections, simplifying system-level routing and integration.
• Industrial temperature support: Rated from -40 °C to 100 °C to meet demanding environmental requirements.
• Compact surface-mount package: 1152-FCBGA (35×35) package provides a dense, production-ready footprint for space-constrained PCBs.
• RoHS compliant: Meets lead-free regulatory requirements for modern electronic assemblies.

Why Choose MPF300T-1FCG1152I?

The MPF300T-1FCG1152I balances large-scale programmable logic, significant embedded memory, and high I/O density within a compact 1152-FCBGA surface-mount package. Its specification set — including 300,000 logic elements, approximately 21.09 Mbits of on-chip RAM, 512 I/O, and an industrial temperature range — positions it for systems that require robust, reconfigurable logic capacity in industrial environments.

This device is well suited to designers and system integrators who need scalable programmable resources and a compact footprint while maintaining compliance with RoHS requirements and low-voltage core operation.

Request a quote or submit a purchase inquiry for MPF300T-1FCG1152I to receive pricing and availability information tailored to your project needs.