MPF200TS-FCSG325I

The MPF200TS-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring substantial logic capacity and embedded memory. It integrates approximately 192,000 logic elements with about 13.6 Mbits of embedded RAM and supports 170 I/O signals, making it suitable for complex control, networking and embedded processing tasks.

Packaged in a 325-ball LFBGA/FC format with surface-mount mounting and an industrial operating range, this device is built for systems that need reliable operation across −40 °C to 100 °C and strict supply voltage control.

Key Features

• Core Capacity Approximately 192,000 logic elements to implement sizeable custom logic, state machines and datapaths.
• Embedded Memory Approximately 13.6 Mbits of on-chip RAM (Total RAM Bits: 13,619,200) for buffering, lookup tables and intermediate storage.
• I/O Density 170 I/O pins to support multiple interfaces, peripheral connections and board-level routing flexibility.
• Power Supply Core supply range from 0.970 V to 1.080 V, enabling precise power budgeting and integration with regulated power rails.
• Package & Mounting 325-ball LFBGA package (Supplier device package: 325-FCBGA, 11 × 14.5 mm) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Environmental Compliance RoHS compliant for regulated manufacturing and product supply chains.

Typical Applications

• Industrial Automation — Implement PLC logic, motor-control interfaces and real-time deterministic control systems using the device's large logic and memory resources.
• Communications & Networking — Use the high I/O count and on-chip RAM for protocol bridging, packet buffering and custom interface logic in networking equipment.
• Embedded Control & Signal Processing — Deploy for embedded controllers and signal-processing pipelines that require parallel logic and local memory for intermediate data storage.
• Test & Measurement — Leverage predictable core supply requirements and industrial temperature rating for instrumentation and measurement platforms operating in varied conditions.

Unique Advantages

• High logic capacity: Approximately 192,000 logic elements enable large-scale custom logic integration on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM provide local buffering and fast access for latency-sensitive functions.
• Generous I/O availability: 170 I/Os allow direct connection to multiple peripherals and parallel busses without external expanders.
• Industrial temperature support: Operation from −40 °C to 100 °C supports deployment in harsh and variable thermal environments.
• Compact surface-mount package: The 325-ball FCBGA/LFBGA footprint (11 × 14.5 mm supplier package) offers high integration density for space-constrained designs.
• Regulatory compliance: RoHS compliance simplifies integration into regulated manufacturing and supply chains.

Why Choose MPF200TS-FCSG325I?

The MPF200TS-FCSG325I positions itself as a robust, high-capacity FPGA option for industrial and embedded designs that require significant logic and memory resources alongside a broad I/O set. Its PolarFire™ architecture and industrial temperature rating make it a practical choice for engineers building control systems, communications equipment, and test platforms that demand reliability and integration.

Customers seeking a scalable, compact FPGA solution will benefit from the device’s combination of logic elements, embedded RAM and a dense BGA package, enabling reduced BOM complexity and streamlined board layouts while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to begin integrating the MPF200TS-FCSG325I into your next design.