MPF200TS-FCG484I

The MPF200TS-FCG484I is a PolarFire™ FPGA IC from Microchip Technology designed for industrial applications requiring substantial programmable logic, embedded memory, and I/O density. It combines 192,000 logic elements with approximately 13.6 Mbits of on-chip RAM and 244 user I/O in a 484-ball FCBGA (23×23) surface-mount package.

This device targets designs where integration, thermal range, and compact packaging matter—delivering sizable logic and memory resources within a single industrial-grade FPGA footprint.

Key Features

• Core Logic  192,000 logic elements provide a large fabric for implementing complex digital logic and custom hardware functions.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM for buffering, packet storage, or intermediate data handling without external memory.
• I/O Capacity  244 user I/O pins enable broad external connectivity for peripherals, sensors, or high-channel-count interfaces.
• Power Supply  Operates from a core voltage range of 0.97–1.08 V, compatible with modern low-voltage power rails.
• Package & Mounting  484-FCBGA (23×23) surface-mount package delivers a compact, high-density footprint for space-constrained PCBs.
• Industrial Temperature Rating  Specified for operation from −40 °C to 100 °C to meet demanding thermal environments.
• Regulatory Compliance  RoHS-compliant construction supports environmentally responsible assembly practices.

Typical Applications

• Industrial Automation  Implement control logic, sensor aggregation, and real-time processing where an industrial temperature range and high I/O count are required.
• Communications & Networking  Use on-chip memory and extensive logic resources for packet buffering, protocol offload, and custom data-path implementations.
• Embedded Signal Processing  Deploy custom processing pipelines and buffering in a single device using the large logic fabric and embedded RAM.

Unique Advantages

• High logic capacity: 192,000 logic elements enable implementation of complex systems and parallel processing architectures.
• Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory and simplifies BOM and board layout.
• Dense I/O in a compact package: 244 I/O in a 484-FCBGA (23×23) package balances connectivity and PCB area efficiency.
• Industrial temperature suitability: Rated −40 °C to 100 °C for deployment in harsh or thermally variable environments.
• Low-voltage core operation: 0.97–1.08 V supply range aligns with modern low-voltage power domains to help optimize overall system power design.
• RoHS compliance: Supports lead-free assembly and environmentally conscious manufacturing processes.

Why Choose MPF200TS-FCG484I?

The MPF200TS-FCG484I is positioned for designs that require a balance of programmable logic density, embedded memory, and substantial I/O in an industrial-grade FPGA. Its combination of 192,000 logic elements and approximately 13.6 Mbits of on-chip RAM supports advanced data-paths and buffering while reducing external component count.

This device is suited to engineers building industrial automation, communications, or embedded processing systems that need a compact, surface-mount FPGA with a wide operating temperature range and high I/O capacity.

Request a quote or submit an inquiry to learn about availability, pricing, and how MPF200TS-FCG484I can fit into your next design.