MPF200TS-1FCSG325I

The MPF200TS-1FCSG325I is a PolarFire™ Field Programmable Gate Array IC from Microchip Technology. It delivers scalable FPGA capacity with 192,000 logic elements and approximately 13.6 Mbits of embedded memory for designs that require on-chip logic and storage.

Designed and specified for industrial use, this surface-mount device provides a 170-pin I/O count, a low-voltage core supply range, and extended operating temperature capability—features that help integrate complex logic, memory, and I/O in space-constrained board designs.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded Memory — Total on-chip RAM of 13,619,200 bits (approximately 13.6 Mbits) for buffering, packet storage, and state machines.
• I/O Count — 170 I/O pins to support multiple external interfaces and high pin-count integration.
• Power — Core voltage supply specified from 970 mV to 1.08 V to match low-voltage system requirements.
• Package & Mounting — 325-LFBGA package (supplier package: 325-FCBGA, 11 × 14.5 mm) in a surface-mount form factor for compact PCB layouts.
• Industrial Grade Temperature Range — Rated for operation from −40 °C to 100 °C to support industrial temperature environments.
• Standards & Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial control systems — Supports designs that require industrial-grade temperature performance (−40 °C to 100 °C) and substantial logic capacity for control and automation functions.
• High-density logic implementations — Provides 192,000 logic elements and approximately 13.6 Mbits of embedded memory for custom datapath, signal processing, and protocol handling.
• Multi-I/O interface hubs — 170 I/O pins facilitate aggregation and routing of multiple peripheral interfaces on a single FPGA device.
• Compact system boards — 325-LFBGA (11 × 14.5 mm) surface-mount package enables integration into space-constrained PCBs.

Unique Advantages

• High logic density: 192,000 logic elements allow significant on-chip implementation of complex functions, reducing external components.
• Substantial embedded memory: Approximately 13.6 Mbits of on-chip RAM supports buffering and local data storage for latency-sensitive tasks.
• Generous I/O capacity: 170 I/O pins give flexibility to connect multiple peripherals and interfaces without external multiplexing.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet environmental demands of industrial deployments.
• Low-voltage core operation: Core voltage range of 0.97 V to 1.08 V supports low-power system architectures and consistent power-domain planning.
• Compact, surface-mount package: 325-LFBGA (325-FCBGA 11 × 14.5 mm) packaging simplifies board-level integration in compact designs.

Why Choose MPF200TS-1FCSG325I?

MPF200TS-1FCSG325I positions itself as a capability-rich PolarFire FPGA for industrial-grade designs that need a balance of logic density, embedded memory, and I/O flexibility. Its specification set—192,000 logic elements, approximately 13.6 Mbits of RAM, 170 I/Os, and an industrial temperature range—supports integration of substantial programmable logic into compact, surface-mount form factors.

This Microchip Technology FPGA is suited for engineers and procurement teams building systems that require reliable operation across extended temperatures, low-voltage core compatibility, and RoHS-compliant manufacturing. Its combination of capacity and package choices offers a clear path for scalable, robust designs.

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