MPF200TS-1FCG784I

The MPF200TS-1FCG784I is a PolarFire™ field programmable gate array (FPGA) IC offered in a 784-FCBGA package. It provides a high-density reconfigurable fabric with substantial embedded memory and a broad I/O complement for industrial-grade applications.

With industrial temperature grading and a low-voltage core supply range, this device is suited to systems that require significant logic capacity, on-chip memory, and a moderate-to-high number of external interfaces in a compact surface-mount package.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex programmable logic and custom functions.
• Logic Blocks — 48,000 logic blocks (CLBs) for structured logic partitioning and resource allocation.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Count — 364 user I/Os to support multiple external interfaces and parallel connections.
• Power — Core supply voltage range of 0.97 V to 1.08 V for the device core power domain.
• Package & Mounting — 784-FCBGA (29 × 29 mm) surface-mount package for high-density board integration.
• Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
• Compliance — RoHS-compliant manufacturing and materials.

Typical Applications

• Industrial Control & Automation — Implement custom control logic, sensor interfacing, and real-time processing using the device's large logic and memory resources within industrial temperature requirements.
• Embedded System Acceleration — Offload compute-intensive, deterministic functions to programmable logic to improve system throughput while maintaining on-chip memory for buffering.
• High-Density I/O Systems — Support multiple external interfaces and parallel I/O connections enabled by 364 user I/Os for mid- to high-pin-count designs.

Unique Advantages

• High logic integration: 192,000 logic elements enable consolidation of multiple functions into a single device, reducing overall system complexity.
• Significant embedded memory: Approximately 13.62 Mbits of on-chip RAM supports buffering and local data storage without external memory.
• Robust I/O capacity: 364 I/Os allow flexible interfacing to sensors, peripherals, and external logic, simplifying board-level routing.
• Industrial-grade thermal range: −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Compact, surface-mount package: 784-FCBGA (29 × 29 mm) gives a balance of high pin count and PCB space efficiency for dense designs.
• Low-voltage core operation: 0.97–1.08 V core supply enables compatibility with low-voltage power architectures.

Why Choose MPF200TS-1FCG784I?

The MPF200TS-1FCG784I offers a combination of large logic capacity, substantial on-chip memory, and a broad I/O set in a compact 784-FCBGA package rated for industrial temperatures. These characteristics make it well suited for engineers designing industrial and embedded systems that require reconfigurable logic, local memory, and flexible interfacing while minimizing board-level component count.

For designs that prioritize scalability of programmable logic and controlled power domains, this PolarFire™ FPGA delivers a practical balance of integration, thermal range, and RoHS-compliant manufacturing to support long-term deployment in industrial applications.

Request a quote or submit an inquiry for MPF200TS-1FCG784I to get pricing, availability, and ordering information.