MPF200TLS-FCSG536I

The MPF200TLS-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial applications that require reconfigurable logic and substantial on-chip memory. It combines a high logic capacity with multi-megabit embedded memory and a 300-pin I/O count in a 536-LFBGA (536-CSPBGA, 16×16) surface-mount package.

With a core supply range of 0.97 V to 1.08 V and an operating temperature range from −40°C to 100°C, this device is targeted at industrial systems that need robust thermal performance and high integration in a compact package.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex, reconfigurable digital designs and system-level integration.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM (13,619,200 bits) for buffering, packet processing, and embedded data storage.
• I/O Density — 300 general-purpose I/Os to support multiple interfaces and high-pin-count system interconnects.
• Package & Mounting — 536-LFBGA / 536-CSPBGA (16×16) surface-mount package provides a compact footprint for PCB-mounted systems.
• Power — Core supply voltage range of 0.97 V to 1.08 V to match modern low-voltage FPGA power domains.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Compliance — RoHS compliant to meet standard environmental requirements.

Typical Applications

• Industrial control systems — Reconfigurable logic and wide temperature range enable deployment in factory automation and control equipment.
• Embedded data processing — Large logic array and multi-megabit embedded memory support on-device processing and buffering tasks.
• I/O-dense systems — 300 I/Os accommodate complex interface requirements for industrial instrumentation and system expansion.

Unique Advantages

• High logic density: 192,000 logic elements provide capacity for complex state machines, custom accelerators, and system integration on a single device.
• Substantial embedded memory: Approximately 13.6 Mbits of on-chip RAM reduces the need for external memory in many designs.
• Robust temperature performance: −40°C to 100°C operating range supports reliability in industrial environments.
• High pin count: 300 I/Os enable flexible connectivity and support for multiple peripheral interfaces.
• Compact surface-mount package: 536-LFBGA / 536-CSPBGA (16×16) offers a balance of density and PCB real estate for production designs.
• Low-voltage core support: Core supply range of 0.97 V to 1.08 V aligns with modern low-voltage system designs.

Why Choose MPF200TLS-FCSG536I?

The MPF200TLS-FCSG536I positions itself as a high-capacity, industrial-grade FPGA option that brings together significant logic resources, multi-megabit embedded memory, and a high I/O count in a compact surface-mount package. Its industrial temperature rating and low-voltage core range make it suitable for robust, long-life deployments where reconfigurable hardware is required.

Designers and procurement teams seeking a scalable FPGA for industrial and embedded systems will find this device offers the integration and environmental range to simplify boards and reduce external components while supporting demanding digital logic and memory needs.

If you would like pricing, availability, or assistance integrating the MPF200TLS-FCSG536I into your design, request a quote or contact sales to submit your requirements and receive a formal quote.