MPF200TLS-FCG484I

IC FPGA 244 I/O 484FBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BFBGA

Quantity 1,650 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGANumber of I/O244Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13619200

Overview of MPF200TLS-FCG484I – PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BFBGA

The MPF200TLS-FCG484I is a PolarFire™ field programmable gate array (FPGA) offered in a 484-ball BFBGA package. The device provides 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 244 I/O pins in a surface-mount 484-FPBGA (19×19) footprint.

Designed for industrial-grade environments, the device operates from 970 mV to 1.08 V and across an operating temperature range of −40 °C to 100 °C. RoHS compliance is indicated for environmental conformity.

Key Features

  • Logic Capacity — 192,000 logic elements to implement complex digital designs and custom logic structures.
  • Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
  • I/O Count — 244 user I/O pins to support wide-ranging peripheral and bus interfaces.
  • Power Supply — Core voltage range of 970 mV to 1.08 V for compatibility with specified power domains.
  • Package and Mounting — 484-BFBGA package, supplier device package 484-FPBGA (19×19), intended for surface-mount assembly.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
  • Regulatory — RoHS compliant for reduced hazardous substance content.

Unique Advantages

  • High logic density: 192,000 logic elements enable substantial on-chip integration of custom logic without immediate external ASIC dependencies.
  • Significant embedded memory: Approximately 13.6 Mbits of RAM supports on-chip buffering and state storage to streamline system memory architecture.
  • Extensive I/O: 244 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and external buses directly to the FPGA.
  • Industrial robustness: Specified operation from −40 °C to 100 °C aligns the device to industrial temperature environments.
  • Compact, surface-mount package: 484-BFBGA / 484-FPBGA (19×19) enables dense PCB layouts while supporting automated assembly processes.
  • RoHS compliance: Helps meet regulatory and environmental requirements for electronic product assemblies.

Why Choose MPF200TLS-FCG484I?

The MPF200TLS-FCG484I positions itself as a capable PolarFire FPGA option where substantial logic resources, embedded memory, and broad I/O are required within an industrial temperature envelope. Its combination of 192,000 logic elements, roughly 13.6 Mbits of on-chip RAM, and 244 I/Os provides a balance of integration and flexibility for demanding system designs.

With a surface-mount 484-BFBGA package and a defined core voltage and temperature range, this device is suitable for engineers and procurement teams seeking a PolarFire FPGA configured for industrial operating conditions and RoHS-compliant production.

Request a quote or submit an inquiry to obtain pricing, availability, and procurement details for the MPF200TLS-FCG484I.

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