MPF200TLS-FCG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BFBGA |
|---|---|
| Quantity | 1,650 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 244 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200TLS-FCG484I – PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BFBGA
The MPF200TLS-FCG484I is a PolarFire™ field programmable gate array (FPGA) offered in a 484-ball BFBGA package. The device provides 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 244 I/O pins in a surface-mount 484-FPBGA (19×19) footprint.
Designed for industrial-grade environments, the device operates from 970 mV to 1.08 V and across an operating temperature range of −40 °C to 100 °C. RoHS compliance is indicated for environmental conformity.
Key Features
- Logic Capacity — 192,000 logic elements to implement complex digital designs and custom logic structures.
- Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
- I/O Count — 244 user I/O pins to support wide-ranging peripheral and bus interfaces.
- Power Supply — Core voltage range of 970 mV to 1.08 V for compatibility with specified power domains.
- Package and Mounting — 484-BFBGA package, supplier device package 484-FPBGA (19×19), intended for surface-mount assembly.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
- Regulatory — RoHS compliant for reduced hazardous substance content.
Unique Advantages
- High logic density: 192,000 logic elements enable substantial on-chip integration of custom logic without immediate external ASIC dependencies.
- Significant embedded memory: Approximately 13.6 Mbits of RAM supports on-chip buffering and state storage to streamline system memory architecture.
- Extensive I/O: 244 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and external buses directly to the FPGA.
- Industrial robustness: Specified operation from −40 °C to 100 °C aligns the device to industrial temperature environments.
- Compact, surface-mount package: 484-BFBGA / 484-FPBGA (19×19) enables dense PCB layouts while supporting automated assembly processes.
- RoHS compliance: Helps meet regulatory and environmental requirements for electronic product assemblies.
Why Choose MPF200TLS-FCG484I?
The MPF200TLS-FCG484I positions itself as a capable PolarFire FPGA option where substantial logic resources, embedded memory, and broad I/O are required within an industrial temperature envelope. Its combination of 192,000 logic elements, roughly 13.6 Mbits of on-chip RAM, and 244 I/Os provides a balance of integration and flexibility for demanding system designs.
With a surface-mount 484-BFBGA package and a defined core voltage and temperature range, this device is suitable for engineers and procurement teams seeking a PolarFire FPGA configured for industrial operating conditions and RoHS-compliant production.
Request a quote or submit an inquiry to obtain pricing, availability, and procurement details for the MPF200TLS-FCG484I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D