MPF200TL-FCVG484E

The MPF200TL-FCVG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density programmable logic fabric with substantial embedded memory and a large I/O count in a compact 484-BFBGA package.

Designed for designs that need significant on-chip logic, embedded RAM and extensive I/O, this device targets applications where integration, power-efficient core voltage operation and a surface-mount BFBGA footprint are important.

Key Features

• Logic Capacity  Provides 192,000 logic elements suitable for complex programmable logic implementations.
• Embedded Memory  Approximately 13.62 Mbits of on-chip RAM to support data buffering, state storage and local memory needs.
• I/O Count  284 user I/Os to accommodate high pin-count interfacing and multi-channel connectivity.
• Power  Core supply range of 0.970 V to 1.080 V for operation within low-voltage FPGA domains.
• Package & Mounting  484-BFBGA with supplier package 484-FPBGA (19×19) in a surface-mount configuration for compact board-level integration.
• Thermal & Grade  Extended grade device rated for operation from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Communications Equipment  Use the device’s high logic density and 284 I/Os for packet processing, protocol bridging and custom interface logic.
• Industrial Control  Leverage the on-chip RAM and extensive I/O for sensor aggregation, control loops and real-time logic tasks within the specified temperature range.
• Embedded Systems  Implement complex state machines, data buffering and peripheral control while benefiting from the compact BFBGA package and surface-mount assembly.

Unique Advantages

• High Logic Integration: 192,000 logic elements enable consolidation of multiple discrete functions into a single programmable device, reducing board-level BOM.
• Substantial On-Chip Memory: Approximately 13.62 Mbits of embedded RAM supports local data storage and reduces external memory dependence.
• Large I/O Count: 284 I/Os simplify connectivity to multiple peripherals, high-channel interfaces and parallel interfaces without additional I/O expanders.
• Compact BFBGA Footprint: 484-ball BFBGA (19×19 supplier footprint) provides a space-efficient package for dense board layouts.
• Low-Voltage Core Operation: 0.970–1.080 V supply range aligns with contemporary low-voltage FPGA designs for power-conscious implementations.
• RoHS Compliant: Environmental compliance supports deployments where hazardous substance restrictions apply.

Why Choose MPF200TL-FCVG484E?

The MPF200TL-FCVG484E combines a high logic element count, sizable embedded RAM and a broad I/O complement in a surface-mount 484-BFBGA package, making it well suited for designs that require dense programmable logic and extensive board-level interfacing. Its extended-grade temperature rating and RoHS compliance offer predictable behavior within the specified operating range and environmental standards.

This FPGA is appropriate for engineering teams building communications, industrial control and embedded systems that need on-chip memory and high I/O capacity, while maintaining a compact board footprint and low-voltage core operation.

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