MPF200TL-FCSG325E

The MPF200TL-FCSG325E is a PolarFire™ Field Programmable Gate Array (FPGA) IC that provides a configurable logic fabric with substantial on-chip resources in a compact ball-grid package. With 192,000 logic elements, approximately 13.62 Mbits of embedded memory and 170 I/O pins, it is suited for designs that require significant programmable logic, embedded RAM, and moderate I/O density.

Key Features

• Logic Capacity — 192,000 logic elements enable large-scale custom logic implementations and complex digital designs.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM for buffering, state storage, and data processing without external memory for many functions.
• I/O Count — 170 I/O pins to support multiple interfaces and peripheral connections in a single device.
• Power Supply — Core operating voltage range from 0.970 V to 1.08 V to match low-voltage system designs.
• Package & Mounting — 325-LFBGA package (supplier device package: 325-FCBGA, 11 × 14.5 mm) designed for surface-mount assembly in compact board layouts.
• Temperature Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in a wide range of ambient conditions.
• Compliance — RoHS compliant, supporting environmental regulatory requirements.

Typical Applications

• Embedded Systems & Prototyping — Implement and iterate custom logic, interfaces, and control functions during development and proof-of-concept work.
• Communications & Networking — Implement packet handling, protocol bridging, or custom interface logic using the device’s logic and I/O resources.
• Custom Processing & Acceleration — Offload or accelerate deterministic data-path processing and custom compute kernels using on-chip logic and memory.
• High-density I/O Interfacing — Aggregate and manage signals from multiple peripherals or subsystems with the available 170 I/O pins.

Unique Advantages

• High logic density: 192,000 logic elements provide room for complex, multi-module designs on a single FPGA.
• Substantial embedded memory: Approximately 13.62 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
• Flexible interfacing: 170 I/O pins enable integration of multiple external devices and interfaces without external expanders.
• Compact, surface-mount package: The 325-LFBGA (11 × 14.5 mm) package saves board area while supporting high-density integration.
• Low-voltage core operation: Core supply range of 0.970 V to 1.08 V aligns with modern low-voltage system architectures.
• Extended operating range: 0 °C to 100 °C operating temperature offers flexibility for a variety of deployment environments.

Why Choose MPF200TL-FCSG325E?

The MPF200TL-FCSG325E provides a balanced combination of logic capacity, embedded memory, and I/O count in a compact 325-LFBGA surface-mount package. Its specifications make it appropriate for designs that require significant on-chip resources while maintaining a small PCB footprint and low-voltage operation.

This device is well suited to development teams and product designs that need scalable programmable logic, on-chip RAM for data handling, and a moderate number of I/O. Its extended temperature grade and RoHS compliance support broader deployment scenarios and manufacturing requirements.

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