MPF200TL-FCSG325I

The MPF200TL-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded logic applications. It provides a high-density programmable fabric with 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 170 user I/O pins to support complex digital designs.

With a low-voltage core supply range and a wide operating temperature window, this surface-mount 325-LFBGA device is suited to demanding environments where integration, predictable power, and extended temperature operation are required.

Key Features

• Logic Capacity  192,000 logic elements for implementing sizable digital functions and custom processors within a single FPGA package.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM to support buffering, lookup tables, and data storage close to the logic fabric.
• I/O  170 user I/O pins provide flexible connectivity for interfacing with peripherals, sensors, and external logic devices.
• Power  Core supply operates from 970 mV to 1.08 V, enabling integration with low-voltage system power rails.
• Package & Mounting  325-LFBGA, FC package (supplier device package: 325-FCBGA, 11×14.5 mm) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for regulatory alignment.

Unique Advantages

• High-density programmable logic: 192,000 logic elements allow consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-processing tasks.
• Generous I/O complement: 170 I/Os enable broad connectivity options for mixed-signal front-ends, control interfaces, and peripheral buses.
• Low-voltage core operation: 0.97–1.08 V supply compatibility supports modern low-voltage system architectures and efficient power design.
• Industrial temperature and RoHS compliance: Rated −40 °C to 100 °C and RoHS compliant for deployments in industrial applications requiring extended temperature operation and environmental compliance.
• Compact surface-mount package: 325-LFBGA (325-FCBGA, 11×14.5 mm) enables high-density PCB integration while maintaining thermal and mechanical robustness.

Why Choose MPF200TL-FCSG325I?

The MPF200TL-FCSG325I positions itself as a robust, industrial-grade FPGA that balances high logic capacity, embedded memory, and a substantial I/O count with a compact LFBGA package. Its low-voltage core and wide operating temperature range make it suitable for designers looking to integrate significant programmable logic into systems that must operate reliably in challenging environments.

This device is well suited for engineering teams and procurement looking for a high-density, RoHS-compliant FPGA option that supports complex on-chip processing and broad external interfacing while fitting compact board footprints.

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