MPF200TL-FCSG536I

The MPF200TL-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded applications. It provides a large fabric of programmable logic (192,000 logic elements and 48,000 CLBs) combined with substantial on-chip RAM to implement complex, high-density designs.

With 300 I/Os, a compact 536-LFBGA (536-CSPBGA, 16×16) package, and low-voltage core operation, this device targets systems that require dense logic integration, flexible I/O, and operation across an industrial temperature range.

Key Features

• Programmable Logic Capacity — 192,000 logic elements and 48,000 CLBs support complex custom logic and large FPGA designs.
• Embedded Memory — Total on-chip RAM of 13,619,200 bits (approximately 13.6 Mbits) for buffering, data storage, and state machines.
• I/O Density — 300 general-purpose I/O pins suitable for connecting to multiple peripherals, sensors, and interfaces.
• Low-Voltage Core — Core supply range from 970 mV to 1.08 V to match low-voltage system rails and support power-managed designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 536-LFBGA / CSPBGA package (supplier package: 536-CSPBGA, 16×16) with surface-mount mounting for compact board-level integration.
• Regulatory Compliance — RoHS-compliant device suitable for lead-free assembly processes.

Typical Applications

• Industrial Control — Implement programmable logic for PLCs, motion control, and real-time I/O aggregation using high logic and I/O density.
• Communications Infrastructure — Use embedded memory and abundant logic elements for packet processing, protocol offload, and interface bridging.
• Instrumentation and Test — Support data acquisition, signal conditioning, and custom processing pipelines where compact packaging and industrial temperature support are required.
• Embedded Compute — Integrate custom accelerators, state machines, and glue logic in space-constrained designs with the 536-CSPBGA footprint.

Unique Advantages

• High Logic Density: 192,000 logic elements and 48,000 CLBs enable implementation of large, complex designs without immediate need for external logic.
• Significant On-Chip Memory: Approximately 13.6 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• Robust I/O Count: 300 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
• Industrial-Grade Thermal Range: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact Surface-Mount Package: The 536-CSPBGA (16×16) package allows dense board layouts while maintaining a high pin count.
• Low-Voltage Operation: Core supply range of 970 mV to 1.08 V assists in designing energy-efficient, low-voltage systems.

Why Choose MPF200TL-FCSG536I?

The MPF200TL-FCSG536I positions itself as a high-density, industrial-grade FPGA suitable for engineers needing substantial programmable logic, embedded memory, and a large I/O complement in a compact surface-mount package. Its specification set—large logic element count, approximately 13.6 Mbits of on-chip RAM, 300 I/Os, and operation across −40 °C to 100 °C—makes it well suited for demanding embedded and industrial designs that require reliable performance and integration.

Choose this device when you require a balance of logic capacity, embedded memory, and industrial thermal capability in a CSPBGA footprint, enabling scalable designs with reduced external component requirements and straightforward board integration.

Request a quote or submit an inquiry for MPF200TL-FCSG536I to receive pricing and availability information for your next design.