MPF200TLS-FCG784I

IC FPGA 364 I/O 784FCBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 364 13619200 192000 784-BBGA, FCBGA

Quantity 727 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O364Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13619200

Overview of MPF200TLS-FCG784I – PolarFire™ Field Programmable Gate Array (FPGA) IC 364 13619200 192000 784-BBGA, FCBGA

The MPF200TLS-FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC offered in a 784-ball FCBGA package. This industrial-grade FPGA integrates a high logic capacity and substantial on-chip memory to support complex, high-density designs that require robust I/O and thermal endurance.

With 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 364 I/O pins, this device targets applications that need substantial integration, predictable power characteristics, and operation across an extended temperature range.

Key Features

  • Logic Capacity — 192,000 logic elements to implement large-scale digital designs and complex logic functions.
  • Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, state storage, and data processing without external memory dependency.
  • I/O Resources — 364 user I/O pins to support multiple interfaces and high-pin-count connectivity requirements.
  • Power — Core supply range from 0.97 V to 1.08 V allowing predictable low-voltage core operation.
  • Package & Mounting — 784-FCBGA (29×29) package in a surface-mount form factor for compact system integration.
  • Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet demanding environmental conditions.
  • Compliance — RoHS compliant for reduced hazardous substance content.

Unique Advantages

  • High integration density: 192,000 logic elements and substantial embedded memory reduce the need for supplementary programmable devices, simplifying system architecture.
  • Strong I/O capability: 364 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
  • Industrial robustness: Operation from −40°C to 100°C supports deployment in thermally challenging environments.
  • Compact, production-ready package: 784-FCBGA (29×29) surface-mount package enables space-constrained board designs while supporting automated assembly.
  • Low-voltage core operation: 0.97 V to 1.08 V supply range helps manage power budgets in complex systems.
  • Regulatory friendliness: RoHS compliance supports environmental and supply-chain requirements.

Why Choose MPF200TLS-FCG784I?

The MPF200TLS-FCG784I positions itself as an industrial-grade FPGA solution for designs that demand high logic capacity, significant embedded memory, and abundant I/O in a compact package. Its specified core voltage range and extended operating-temperature rating make it suitable for deployed systems where power predictability and thermal resilience are important design considerations.

This device is well suited for engineering teams looking to consolidate functions into a single programmable device to reduce BOM complexity while maintaining the flexibility to implement sophisticated digital logic. RoHS compliance and the surface-mount 784-FCBGA package support modern manufacturing and regulatory needs.

Request a quote or submit an inquiry to our sales team for pricing, lead time, and availability of the MPF200TLS-FCG784I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up