MPF200TLS-FCVG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 13619200 192000 484-BFBGA |
|---|---|
| Quantity | 140 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200TLS-FCVG484I – PolarFire™ Field Programmable Gate Array (FPGA) IC, 192,000 logic elements, 284 I/O, 484-BFBGA
The MPF200TLS-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade programmable logic applications. It combines high logic capacity with substantial embedded memory and a large I/O count to support complex, I/O-intensive designs.
With an industrial operating temperature range and a compact BFBGA package, this device is suitable for systems that require reliable programmable logic across a wide temperature span and a defined core voltage supply range.
Key Features
- Core Logic 192,000 logic elements provide significant on-chip programmable logic capacity for implementing complex digital functions.
- Embedded Memory Approximately 13.6 Mbits of total on-chip RAM bits to support buffer, caching, and data-path requirements.
- I/O 284 general-purpose I/O pins to accommodate designs with high external connectivity needs.
- Power Voltage supply range of 0.97 V to 1.08 V to match system supply planning for core operation.
- Package & Mounting 484-BFBGA package, supplier device package listed as 484-FPBGA (19x19), and surface-mount mounting type for compact board integration.
- Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C.
- Compliance RoHS compliant, supporting environmental and assembly compliance requirements.
Typical Applications
- Industrial Systems Designed for industrial deployments that require an industrial-grade FPGA with extended temperature capability and a robust I/O count.
- I/O-Intensive Designs Suitable for applications that need large numbers of external connections—284 I/O support complex peripheral and sensor interfacing.
- High-Density Logic Implementation Use the 192,000 logic elements and approximately 13.6 Mbits of embedded memory to implement sizable custom logic and data-path functions.
Unique Advantages
- High logic density: 192,000 logic elements enable integration of complex digital functions on a single device, reducing board-level complexity.
- Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM supports large buffering and state storage without external memory.
- Abundant I/O: 284 I/O pins provide flexibility for connecting multiple peripherals, sensors, or external interfaces.
- Industrial temperature capability: Rated for −40°C to 100°C operation to meet demanding environmental requirements.
- Compact BFBGA package: 484-BFBGA / supplier 484-FPBGA (19x19) enables high-density PCB designs with surface-mount assembly.
- Regulatory compliance: RoHS compliant to support environmentally conscious manufacturing and assembly processes.
Why Choose MPF200TLS-FCVG484I?
The MPF200TLS-FCVG484I positions itself as a capable PolarFire FPGA option for designs that demand a combination of high logic capacity, significant embedded memory, and extensive I/O in an industrial-grade package. Its specified operating temperature range and RoHS compliance make it appropriate for applications requiring environmental robustness and regulatory alignment.
This device is well suited to customers implementing complex programmable logic where integration density, reliable operation across −40°C to 100°C, and defined supply requirements (0.97–1.08 V) are important design factors. Manufactured by Microchip Technology, it fits designs that prioritize measurable on-chip resources and package-level integration.
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