MPF200TS-1FCSG536I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 300 13619200 192000 536-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,139 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 536-CSPBGA (16x16) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 536-LFBGA, CSPBGA | Number of I/O | 300 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200TS-1FCSG536I – PolarFire™ Field Programmable Gate Array (FPGA) IC, 192,000 Logic Elements, 300 I/O
The MPF200TS-1FCSG536I is a PolarFire™ FPGA IC from Microchip Technology. It combines high logic capacity and substantial embedded memory in a surface-mount 536-LFBGA / 536-CSPBGA (16×16) package, and is specified for industrial-grade operation.
Key hardware characteristics include 192,000 logic elements, approximately 13.62 Mbits of on-chip RAM, 300 I/O pins, and a core supply range of 0.97 V to 1.08 V, enabling dense, low-voltage FPGA implementations for industrial applications across a wide temperature range.
Key Features
- Logic Capacity — 192,000 logic elements provide a large fabric for implementing complex digital logic and custom accelerators.
- Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive functions.
- I/O — 300 user I/O pins to accommodate a wide variety of external interfaces and system connectivity.
- Power — Core voltage specified from 0.97 V to 1.08 V to match low-voltage system power domains.
- Package and Mounting — Supplied in a 536-LFBGA / 536-CSPBGA (16×16) package; surface-mount mounting type for compact board integration.
- Industrial Grade and Temperature Range — Rated industrial grade with operating temperature from -40 °C to 100 °C for deployment in demanding environments.
Unique Advantages
- High Logic Density: 192,000 logic elements enable implementation of large-scale designs within a single device, reducing board-level complexity.
- Significant On-Chip Memory: Approximately 13.62 Mbits of RAM supports complex buffering and data-path requirements without external memory.
- Generous I/O Count: 300 I/O pins provide flexibility for multiple interfaces and peripheral connections.
- Industrial Temperature Qualified: -40 °C to 100 °C rating aligns the device with industrial deployment needs.
- Compact Surface-Mount Package: 536-CSPBGA (16×16) packaging offers a compact footprint for space-constrained designs.
- Low-Voltage Core Operation: 0.97 V to 1.08 V supply range supports integration into modern low-power systems.
Why Choose MPF200TS-1FCSG536I?
The MPF200TS-1FCSG536I positions itself as a high-capacity, industrial-grade FPGA option from Microchip Technology, combining a large logic fabric, considerable on-chip RAM, and a broad I/O set in a compact BGA package. Its operating range and mounting style make it suitable for engineered systems requiring reliable, dense programmable logic.
Choose this device when your design requires substantial logic resources and embedded memory within an industrial-temperature FPGA footprint, and when a compact 536-ball CSPBGA package is preferred for board-level integration.
Request a quote or submit an inquiry to obtain pricing and availability for the MPF200TS-1FCSG536I. Technical and commercial details can be provided on request.

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