MPF200TS-1FCSG536I

IC FPGA 300 I/O 536CSPBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 300 13619200 192000 536-LFBGA, CSPBGA

Quantity 1,139 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O300Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13619200

Overview of MPF200TS-1FCSG536I – PolarFire™ Field Programmable Gate Array (FPGA) IC, 192,000 Logic Elements, 300 I/O

The MPF200TS-1FCSG536I is a PolarFire™ FPGA IC from Microchip Technology. It combines high logic capacity and substantial embedded memory in a surface-mount 536-LFBGA / 536-CSPBGA (16×16) package, and is specified for industrial-grade operation.

Key hardware characteristics include 192,000 logic elements, approximately 13.62 Mbits of on-chip RAM, 300 I/O pins, and a core supply range of 0.97 V to 1.08 V, enabling dense, low-voltage FPGA implementations for industrial applications across a wide temperature range.

Key Features

  • Logic Capacity — 192,000 logic elements provide a large fabric for implementing complex digital logic and custom accelerators.
  • Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive functions.
  • I/O — 300 user I/O pins to accommodate a wide variety of external interfaces and system connectivity.
  • Power — Core voltage specified from 0.97 V to 1.08 V to match low-voltage system power domains.
  • Package and Mounting — Supplied in a 536-LFBGA / 536-CSPBGA (16×16) package; surface-mount mounting type for compact board integration.
  • Industrial Grade and Temperature Range — Rated industrial grade with operating temperature from -40 °C to 100 °C for deployment in demanding environments.

Unique Advantages

  • High Logic Density: 192,000 logic elements enable implementation of large-scale designs within a single device, reducing board-level complexity.
  • Significant On-Chip Memory: Approximately 13.62 Mbits of RAM supports complex buffering and data-path requirements without external memory.
  • Generous I/O Count: 300 I/O pins provide flexibility for multiple interfaces and peripheral connections.
  • Industrial Temperature Qualified: -40 °C to 100 °C rating aligns the device with industrial deployment needs.
  • Compact Surface-Mount Package: 536-CSPBGA (16×16) packaging offers a compact footprint for space-constrained designs.
  • Low-Voltage Core Operation: 0.97 V to 1.08 V supply range supports integration into modern low-power systems.

Why Choose MPF200TS-1FCSG536I?

The MPF200TS-1FCSG536I positions itself as a high-capacity, industrial-grade FPGA option from Microchip Technology, combining a large logic fabric, considerable on-chip RAM, and a broad I/O set in a compact BGA package. Its operating range and mounting style make it suitable for engineered systems requiring reliable, dense programmable logic.

Choose this device when your design requires substantial logic resources and embedded memory within an industrial-temperature FPGA footprint, and when a compact 536-ball CSPBGA package is preferred for board-level integration.

Request a quote or submit an inquiry to obtain pricing and availability for the MPF200TS-1FCSG536I. Technical and commercial details can be provided on request.

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