MPF200TS-1FCVG484I

The MPF200TS-1FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 484-BFBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a broad set of I/O resources, packaged for surface-mount assembly and designed for industrial operating conditions.

With 192,000 logic elements and approximately 13.6 Mbits of on-chip RAM, this device targets designs that require dense custom logic, significant local memory, and up to 284 device I/O pins while operating across a wide temperature range and low-voltage core supply.

Key Features

• Core Logic — 192,000 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, local data storage, and state retention within designs.
• I/O Capacity — 284 device I/O pins to support a wide range of parallel interfaces and external connectivity options.
• Power — Core supply range of 970 mV to 1.08 V to match low-voltage system architectures.
• Package and Mounting — 484-BFBGA (supplier package: 484-FPBGA, 19 × 19) in a surface-mount form factor suitable for compact, high-density PCBs.
• Temperature Grade — Industrial operating temperature from –40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS-compliant construction.

Typical Applications

• Industrial Control and Automation — Implement motion control, PLC logic, and custom control algorithms using dense logic and on-chip memory while meeting industrial temperature requirements.
• Networking and Communications — Use the device’s large logic capacity and 284 I/Os for protocol processing, packet handling, and custom interface bridging.
• Data Processing and Acceleration — Deploy custom accelerators and data-paths that leverage the device’s logic density and embedded RAM for local buffering and compute staging.
• Prototyping and Custom Hardware — Rapidly develop and iterate FPGA-based designs that require significant logic resources and configurable I/O in a compact BFBGA package.

Unique Advantages

• High Logic Density: 192,000 logic elements enable implementation of complex digital systems and multi-function designs without immediate partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 13.6 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Generous I/O Count: 284 I/O pins allow flexible connectivity to peripherals, sensors, and high-pin-count interfaces directly from the FPGA.
• Industrial Temperature Support: Rated from –40 °C to 100 °C for use in temperature-challenging installations and industrial equipment.
• Compact, Surface-Mount Package: 484-BFBGA (19 × 19 supplier package) provides a space-efficient footprint for high-density board designs.
• RoHS Compliant: Environmentally compliant construction supports regulatory and manufacturing requirements.

Why Choose MPF200TS-1FCVG484I?

The MPF200TS-1FCVG484I positions itself as a high-density PolarFire FPGA option for engineers who require extensive programmable logic, significant embedded memory, and a broad I/O complement in an industrial-temperature, surface-mount package. Its combination of 192,000 logic elements, approximately 13.6 Mbits of RAM, and 284 I/Os makes it well suited to compact, demanding designs that need on-chip resources and robust thermal performance.

Designed and manufactured by Microchip Technology, this RoHS-compliant device is appropriate for teams developing industrial systems, communications equipment, and custom accelerators that benefit from long-term scalability and a compact BFBGA form factor.

Request a quote or contact sales to discuss pricing, availability, and to initiate a procurement or evaluation request for MPF200TS-1FCVG484I.