MPF200TS-FCS325M

The MPF200TS-FCS325M is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density programmable fabric with 192,000 logic elements and approximately 13.95 Mbits of on-chip RAM for complex digital designs.

Engineered for military-grade applications, this device combines a broad operating temperature range and a compact 325-TFBGA package with 170 I/Os, making it suitable for systems that require high logic capacity, substantial embedded memory, and reliable operation across extreme temperatures.

Key Features

• Core Logic — 192,000 logic elements to implement advanced digital functions and customizable processing blocks.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Capacity — 170 user I/Os to support dense peripheral and signal connectivity in compact board layouts.
• Power Supply — Operates from 0.97 V to 1.08 V supply rails, enabling integration into tightly constrained power domains.
• Package & Mounting — 325-TFBGA (supplier package: 325-BGA, 11×11) in a surface-mount form factor for space-efficient PCB designs.
• Temperature & Grade — Military grade with an operating range of −55 °C to 125 °C for high-reliability thermal environments.
• Regulatory — RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Military and Defense Systems — Leverages military grade temperature range and high logic density for rugged, mission-critical electronics.
• High-Density I/O Control — 170 I/Os and large logic capacity enable complex control, routing, and interface aggregation in compact systems.
• Embedded Signal Processing — Significant embedded memory and logic elements support buffering, parallel processing, and custom datapath implementations.

Unique Advantages

• High Logic Density: 192,000 logic elements provide the programmable resources needed for complex, large-scale designs.
• Substantial On-Chip Memory: Approximately 13.95 Mbits of RAM reduces dependence on external memory for many buffering and storage tasks.
• Wide Operating Temperature: Rated from −55 °C to 125 °C to meet strict thermal requirements in harsh environments.
• Compact, High-Pin Package: 325-TFBGA (325-BGA, 11×11) balances pin count and board space for dense system implementations.
• RoHS Compliant: Ready for lead-free manufacturing and compliance-driven designs.

Why Choose MPF200TS-FCS325M?

The MPF200TS-FCS325M positions itself as a high-capacity FPGA option for designs that demand significant programmable logic, meaningful embedded memory, and reliability across extreme temperatures. Its combination of 192,000 logic elements, roughly 13.95 Mbits of on-chip RAM, and 170 I/Os in a 325-TFBGA package suits teams building military-grade or other high-reliability systems.

Backed by Microchip Technology and RoHS compliance, this device is intended for designers seeking a robust, high-density programmable platform that supports compact board integration and demanding thermal conditions.

Request a quote or submit a sales inquiry to learn about availability and pricing for the MPF200TS-FCS325M.