MPF200TS-FCVG484I

The MPF200TS-FCVG484I is a PolarFire™ field programmable gate array (FPGA) offered in a 484-ball BFBGA package for surface-mount applications. It provides a large programmable fabric, substantial on-chip memory, and a high I/O count suited to industrial-grade designs.

Key capabilities include 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and operation across a wide temperature and supply range—features that support complex custom logic, high-density I/O interfacing, and robust deployment in industrial environments.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex custom digital logic and large-scale programmable functions.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, state storage, and data-path implementation.
• I/O Density — 284 user I/O pins to support extensive external interfacing and parallel connectivity.
• Power Supply — Core supply range from 0.970 V to 1.080 V to match system power-rail requirements.
• Operating Range — Rated for industrial temperatures from −40 °C to 100 °C for reliable field operation.
• Package & Mounting — 484-BFBGA (supplier package: 484-FPBGA, 19×19) in a surface-mount form factor for compact board-level integration.
• Industrial Grade — Specified as industrial grade to align with demanding environments and extended temperature operation.

Typical Applications

• Industrial control and automation — Implement custom control logic and high-density I/O interfaces using the device’s large logic capacity and 284 I/Os.
• Communications and networking nodes — Deploy embedded memory and extensive logic elements to handle packet processing, buffering, and protocol adaptation tasks.
• Data acquisition and processing — Use abundant on-chip RAM and logic resources for sensor data aggregation, preprocessing, and real-time decision-making in industrial systems.

Unique Advantages

• High programmable capacity: 192,000 logic elements enable implementation of sizable custom architectures without immediate migration to larger devices.
• Significant on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage functions.
• Extensive I/O support: 284 I/Os provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front ends.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, surface-mount BFBGA package: 484-ball footprint (19×19) balances integration density with board-level serviceability and routing efficiency.
• Defined core supply window: Operates from 0.970 V to 1.080 V, enabling predictable power design around the FPGA core.

Why Choose MPF200TS-FCVG484I?

The MPF200TS-FCVG484I combines a large logic fabric, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount BFBGA package—making it a practical choice for designs that require significant custom logic, on-chip buffering, and dense external connectivity. Its specified operating temperature range and defined supply window support reliable integration into industrial systems where environmental tolerance and predictable power behavior matter.

This device is suited for engineers and teams building mid-to-high complexity programmable systems who need scalable logic capacity, embedded memory for data-paths, and ample I/O in a compact package. The combination of these attributes helps reduce external BOM elements and supports long-term deployment in industrial applications.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the MPF200TS-FCVG484I.