MPF300T-1FCG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 244 21094400 300000 484-BBGA, FCBGA |
|---|---|
| Quantity | 542 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 244 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21094400 |
Overview of MPF300T-1FCG484I – PolarFire FPGA, 300,000 Logic Elements, 244 I/O, 484-FCBGA
The MPF300T-1FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade embedded systems. It integrates 300,000 logic elements with approximately 21.09 Mbits of on-chip RAM and provides 244 user I/O pins in a compact 484-FCBGA (23×23) surface-mount package.
With an industrial operating temperature range and a core supply voltage range of 0.970 V to 1.08 V, this device is targeted at applications that require high logic capacity, substantial embedded memory, and robust environmental performance.
Key Features
- Core Logic 300,000 logic elements (logic cells) to implement complex custom logic and parallel datapaths.
- Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
- I/O 244 user I/O pins to support a wide range of external interfaces and board-level connectivity.
- Power Core supply voltage range from 0.970 V to 1.08 V for the FPGA fabric.
- Package & Mounting 484-FCBGA (23×23) ball grid array package, surface mount mounting for high-density board integration.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant to meet environmental and materials requirements.
Typical Applications
- Industrial control and automation Industrial-grade temperature rating and high logic capacity make this FPGA suitable for programmable controllers, motion control, and factory automation systems.
- High-density I/O systems 244 I/O pins provide the connectivity needed for multi-channel data acquisition, sensor aggregation, and complex peripheral interfaces.
- Custom embedded processing Large logic resources and embedded RAM support custom datapaths, protocol offload, and real-time processing in embedded systems.
Unique Advantages
- High logic capacity: 300,000 logic elements enable implementation of large-scale custom logic and parallel processing architectures.
- Significant on-chip memory: Approximately 21.09 Mbits of embedded RAM reduces reliance on external memory for many buffering and table storage needs.
- Substantial I/O count: 244 I/O pins simplify board-level designs that require many channels or mixed-signal interfacing without additional bridging devices.
- Industrial temperature range: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
- Compact FCBGA package: 484-FCBGA (23×23) offers a high-density, surface-mount form factor for space-constrained PCBs.
- Low-voltage core operation: Core supply range of 0.970 V to 1.08 V to match modern FPGA power requirements.
Why Choose MPF300T-1FCG484I?
The MPF300T-1FCG484I delivers a balanced combination of large logic capacity, substantial embedded memory, and extensive I/O in an industrial-grade FPGA package. Its specifications make it well suited for engineers designing robust embedded systems that require scalable programmable logic and reliable operation across a wide temperature range.
Designed and manufactured by Microchip Technology, this device is a solid option for teams building industrial control, high-density I/O, and custom processing solutions that demand on-chip resources and a compact board footprint.
Request a quote or submit an inquiry for MPF300T-1FCG484I to check availability, lead times, and pricing. Our team can assist with technical details and ordering information.

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