MPF300T-1FCG784I

The MPF300T-1FCG784I is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It integrates a large logic capacity, substantial on-chip memory, and a high I/O count to support complex, reconfigurable digital designs.

This device targets applications that require significant embedded logic and memory in a compact surface-mount package while meeting industrial temperature and RoHS compliance requirements.

Key Features

• Logic Capacity  Approximately 300,000 logic elements to implement complex custom logic, state machines, and data-paths.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for buffering, FIFOs, and temporary data storage.
• I/O  388 user I/O pins to support dense peripheral interfaces and multi-channel connectivity.
• Power  Core voltage supply range of 970 mV to 1.08 V to match low-voltage power domains.
• Package and Mounting  784‑FBGA package (784‑FCBGA, supplier device package 784‑FCBGA 29×29) in a surface-mount form factor for board-level integration.
• Temperature and Grade  Industrial grade operation from −40 °C to 100 °C suitable for deployed industrial environments.
• Environmental Compliance  RoHS compliant for environmentally regulated designs.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation, and protocol bridging within industrial automation systems using the device's high logic density and I/O count.
• Communications and Networking  Use the abundant logic resources and on-chip memory to implement packet processing, interfaces, or protocol handling in communications equipment.
• Test and Measurement  Deploy reconfigurable measurement and signal processing functions that benefit from large embedded RAM and extensive I/O connectivity.

Unique Advantages

• High logic integration: Approximately 300,000 logic elements enable large, consolidated designs that reduce external component count.
• Significant on-chip memory: Approximately 21.09 Mbits of embedded RAM supports buffering and local data processing without immediate reliance on external memory.
• Dense I/O capability: 388 I/O pins provide flexibility for multi-channel interfaces and peripheral connectivity on a single device.
• Industrial-rated operation: Specified for −40 °C to 100 °C operation, making it suitable for industrial deployment environments.
• Compact surface-mount package: The 784‑FCBGA (29×29) package offers a high-pin-count, board-level solution for space-constrained systems.
• Regulatory compliance: RoHS compliance supports designs targeting regulated markets and sustainability goals.

Why Choose MPF300T-1FCG784I?

The MPF300T-1FCG784I combines a large logic fabric, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount 784‑FCBGA package. These characteristics make it well suited for engineers developing complex, reconfigurable systems that must operate across demanding temperature ranges.

Backed by Microchip Technology, this PolarFire FPGA provides a platform for scalable designs where on-chip resources, I/O density, and industrial robustness are key considerations for long-term deployment.

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