MPF300T-1FCG784NE

The MPF300T-1FCG784NE is a PolarFire™ field programmable gate array (FPGA) from Microchip Technology featuring 300,000 logic elements and approximately 21.6 Mbits of embedded memory. This surface-mount FCBGA device provides 388 user I/O and is offered in a 784-ball FCBGA (29 × 29 mm) package.

With a core supply range of 970 mV to 1.08 V and an extended commercial operating junction temperature range of 0 °C to 100 °C, this FPGA targets designs that require high logic density, substantial on-chip RAM, and a compact ball-grid package while meeting RoHS compliance.

Key Features

• Logic Capacity — 300,000 logic elements (cells) to support complex programmable logic implementations.
• Embedded Memory — Approximately 21.6 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources — 388 user input/output pins suitable for high pin-count interfaces and board integration.
• Power — Core voltage supply specified at 970 mV to 1.08 V to align with low-voltage FPGA power domains.
• Package and Mounting — 784-BBGA (FCBGA) surface-mount package; supplier device package 784-FCBGA (29×29 mm) for dense system layouts.
• Temperature Grade — Extended commercial grade with an operating junction temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.

Unique Advantages

• High logic density: 300,000 logic elements provide headroom for large finite state machines, datapaths, and custom hardware accelerators.
• Significant on-chip RAM: Approximately 21.6 Mbits of embedded memory reduces dependency on external memory for many buffering and local-data tasks.
• Extensive I/O capability: 388 I/Os enable integration of multiple parallel interfaces and peripheral connections without external multiplexing.
• Compact, manufacturable package: 784-FCBGA (29×29) surface-mount package supports high-density PCB layouts and automated assembly processes.
• Defined operating envelope: Core voltage and extended temperature grade are specified (970 mV–1.08 V; 0 °C–100 °C), aiding thermal and power budgeting during design.
• Regulatory readiness: RoHS compliance supports deployment in regions and products where lead-free solder and restricted substances are required.

Why Choose MPF300T-1FCG784NE?

The MPF300T-1FCG784NE positions itself where high logic capacity and substantial embedded memory are required in a compact, surface-mount FCBGA package. Its 300,000 logic elements and roughly 21.6 Mbits of RAM support complex, integrated FPGA designs while the 388 I/O count and 29×29 mm package help simplify board-level integration.

Engineers and procurement teams looking for a RoHS-compliant PolarFire FPGA with clearly defined power and thermal parameters (970 mV–1.08 V core, 0 °C–100 °C junction) will find this device suitable for designs that demand predictable electrical and thermal planning along with strong on-chip resources.

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