MPF300T-1FCSG536I

The MPF300T-1FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC featuring 300,000 logic elements and approximately 21.09 Mbits of embedded memory. Built as an industrial-grade, surface-mount device in a 536-LFBGA / 536-CSPBGA (16×16) package, it targets designs that require high-density programmable logic, substantial on-chip RAM, and a broad I/O complement.

With a nominal core supply range of 970 mV to 1.08 V and an operating temperature range of −40°C to 100°C, this device is suited for deployment in temperature-sensitive and industrial environments where sustained operation and integration density are important.

Key Features

• Logic Capacity  Provides 300,000 logic elements for complex combinational and sequential designs, enabling implementation of large-scale digital functions on a single device.
• Embedded Memory  Includes approximately 21.09 Mbits of on-chip RAM to support buffering, data processing, and state retention without external memory.
• I/O Density  Up to 300 I/O pins to support extensive peripheral and interface connectivity for multi-channel, multi-protocol systems.
• Power Supply  Operates from a core voltage range of 970 mV to 1.08 V, allowing designers to plan power delivery and sequencing to match system requirements.
• Package and Mounting  Available in a 536-LFBGA / 536-CSPBGA (16×16) package for high-density PCB layouts; surface-mount mounting type facilitates modern assembly processes.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C to support industrial applications and extended environmental conditions.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances, aiding regulatory and environmental compliance.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and high I/O count enable motor control, PLC interfacing, and complex automation logic in factory and plant environments.
• High-Density Digital Processing  Large logic capacity and significant embedded memory support signal processing, protocol handling, and custom compute blocks within a single FPGA.
• Embedded System Integration  Combination of logic resources, on-chip RAM, and extensive I/O makes the device suitable for consolidating multiple functions in compact embedded platforms.

Unique Advantages

• High Integration: The combination of 300,000 logic elements and approximately 21.09 Mbits of RAM reduces the need for external components, simplifying BOM and board area.
• Robust Environmental Tolerance: Industrial operating range of −40°C to 100°C supports deployment in harsh or temperature-variable settings.
• Generous I/O Count: Up to 300 I/O pins provide flexibility for connecting sensors, controllers, buses, and peripherals directly to the FPGA fabric.
• Compact, Assembly-Friendly Package: 536-LFBGA / 536-CSPBGA (16×16) surface-mount package enables high-density PCB design and compatibility with standard SMT assembly workflows.
• Regulatory Compatibility: RoHS compliance helps meet environmental regulatory requirements and supports greener product design.

Why Choose MPF300T-1FCSG536I?

The MPF300T-1FCSG536I positions itself as a high-capacity, industrial-grade FPGA option for designers needing substantial programmable logic, on-chip memory, and a high I/O count in a compact surface-mount package. Its supply voltage range and temperature rating support reliable operation across a range of industrial systems.

This device is well suited for engineering teams building consolidated digital systems—where integration, board space savings, and environmental tolerance provide long-term value—and for projects that require a balance of logic density and on-chip memory without adding external components.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MPF300T-1FCSG536I. Our team can provide purchasing details and support for volume or production planning.