MPF300T-1FCG784NI

The MPF300T-1FCG784NI is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for complex, I/O-dense embedded systems. It combines high logic element density with significant on-chip memory and a broad I/O complement to support demanding industrial applications.

With an industrial operating temperature range and a 784-FCBGA package, this device targets applications that require robust operation, extensive integration, and compact board-level mounting.

Key Features

• Core Density 300,000 logic elements provide capacity for large-scale digital designs and complex custom logic implementations.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory in many designs.
• I/O and Connectivity 388 programmable I/O pins enable broad external interfacing and high channel counts for sensors, peripherals, and communications.
• Power Core supply voltage range of 0.97 V to 1.08 V to match system-level power domains and enable stable core operation.
• Package and Mounting 784-FCBGA (29 × 29 mm) package in a surface-mount form factor for dense PCB integration.
• Temperature and Grade Industrial-grade device rated for operation from –40 °C to 100 °C to support deployment in demanding environments.
• Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control & Automation — Use the device’s high logic capacity and 388 I/Os to implement complex control algorithms, sensor aggregation, and machine I/O interfaces across an industrial temperature range.
• Communications Infrastructure — Leverage substantial embedded RAM and dense logic resources for data buffering, protocol handling, and interface bridging in network equipment.
• Imaging and Test Equipment — Deploy the combination of logic density and abundant I/O to handle parallel data capture, preprocessing, and real-time signal paths.

Unique Advantages

• High logic integration: 300,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing external components and board complexity.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces reliance on external memory for buffering and working data sets.
• Extensive I/O capacity: 388 I/Os support high channel counts and flexible peripheral interfacing without frequent use of expansion devices.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet environmental demands of factory and field deployments.
• Compact BGA packaging: 784-FCBGA (29 × 29 mm) surface-mount package enables dense PCB layouts while providing a large ball count for signals and power.
• Standards-conscious manufacturing: RoHS compliance aligns with lead-free manufacturing requirements.

Why Choose MPF300T-1FCG784NI?

The MPF300T-1FCG784NI positions itself as a high-capacity, industrial-grade FPGA solution for designers needing substantial logic resources, embedded memory, and a large I/O footprint in a compact surface-mount package. Its operating range and package options make it suitable for robust embedded systems where integration and reliability are priorities.

As a PolarFire™ device from Microchip Technology, it offers a combination of scalability and integration that supports long-term design plans—allowing systems engineers to consolidate functions, reduce bill-of-materials, and target a broad set of industrial and infrastructure applications.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the MPF300T-1FCG784NI.