MPF300T-1FCG1152E

The MPF300T-1FCG1152E is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering substantial on-chip logic and memory resources in a high-density FCBGA package. It delivers approximately 300,000 logic elements and approximately 21.09 Mbits of embedded memory together with 512 general-purpose I/Os, making it suitable for designs that require extensive programmable logic, significant embedded RAM, and broad external interfacing.

Packaged in a 1152-BBGA (1152-FCBGA, 35×35) surface-mount package and specified for a 0 °C to 100 °C operating range with an extended grade, this device targets applications where integration density, defined thermal range, and low-voltage core operation are important design considerations.

Key Features

• Core Logic  Approximately 300,000 logic elements provide a large fabric for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without relying solely on external memory.
• I/O Density  512 user I/Os enable wide parallel interfaces and flexible pin assignments for multi-channel systems and high-bandwidth peripheral connectivity.
• Power Supply  Core supply specified from 970 mV to 1.08 V to match low-voltage power domains and support power-optimized FPGA operation.
• Package & Mounting  1152-BBGA / 1152-FCBGA (35×35) surface-mount package delivers a compact, high-pin-count solution for space-constrained PCBs.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments that require defined commercial-to-extended thermal capability.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements for lead-free assembly.

Unique Advantages

• High logic capacity: The large logic element count supports integration of multiple functions and accelerators onto a single FPGA, reducing board-level component count.
• Significant embedded memory: Approximately 21.09 Mbits of RAM enables internal buffering and state storage, minimizing dependence on external memory and improving data-path efficiency.
• Broad I/O support: 512 I/Os provide flexibility for parallel interfaces, multi-channel data acquisition, and extensive peripheral connectivity without intermediate I/O expanders.
• Compact, high-pin package: The 1152-FCBGA (35×35) package delivers high interconnect density in a surface-mount form factor suited to modern PCB layouts.
• Low-voltage core operation: Core supply range of 970 mV to 1.08 V supports integration into low-voltage power architectures for reduced power consumption.
• Extended-grade operation: Rated for 0 °C to 100 °C operation, providing a defined thermal range for applications requiring extended commercial temperature capability.

Why Choose MPF300T-1FCG1152E?

The MPF300T-1FCG1152E positions itself as a high-capacity, high-density FPGA solution that combines extensive logic resources, meaningful on-chip memory, and a large number of I/Os in a compact FCBGA package. Its low-voltage core supply and RoHS compliance align with modern low-power, manufacturable system designs.

This device is well suited to engineering teams and designs that need to consolidate functionality into a single programmable device while maintaining flexible I/O and on-chip memory. The extended-grade temperature range and surface-mount FCBGA package contribute to a scalable, integrated platform for system-level consolidation.

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