MPF200TS-FCSG536I

The MPF200TS-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded applications. It provides a large logic fabric and on-chip memory for custom hardware implementation and system integration in designs requiring robust temperature and supply operating ranges.

Key Features

• Logic Capacity  Provides 192,000 logic elements to implement complex digital functions and custom accelerators.
• Embedded Memory  Includes approximately 13.6 Mbits of total on-chip RAM for data buffering, state storage, and memory-mapped functions.
• I/O Resources  Offers 300 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package and Mounting  Delivered in a 536-LFBGA (536-CSPBGA, 16×16) package for surface-mount PCB assembly.
• Power Supply  Core voltage supply range is 0.97 V to 1.08 V, enabling designs that target the specified core operating window.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control Systems  Implement real-time control, sensor interfacing, and custom IO handling using the device's large logic capacity and industrial temperature rating.
• Embedded Processing and Acceleration  Create hardware accelerators and bespoke data paths leveraging 192,000 logic elements and on-chip RAM.
• Communications and Networking Equipment  Use available I/O density and embedded memory for protocol handling, packet buffering, and interface bridging in infrastructure designs.

Unique Advantages

• Substantial Logic Resources: 192,000 logic elements enable implementation of complex, high-density designs without immediate partitioning across multiple devices.
• Significant On-Chip Memory: Approximately 13.6 Mbits of embedded RAM supports buffering and stateful processing close to logic to reduce external memory dependency.
• High I/O Count: 300 I/Os provide flexibility for diverse peripheral connectivity and board-level integration.
• Industrial Readiness: Temperature rating from −40 °C to 100 °C and surface-mount package options make the device suitable for industrial deployment scenarios.
• Compact, Manufacturable Package: 536-LFBGA (16×16) CSPBGA packaging supports automated surface-mount assembly and dense PCB integration.
• Regulatory Compliance: RoHS compliance facilitates integration into lead-free manufacturing flows.

Why Choose MPF200TS-FCSG536I?

The MPF200TS-FCSG536I positions itself as a robust solution for industrial embedded designs that require a substantial amount of reconfigurable logic, on-chip memory, and a high I/O count in a compact BGA package. Its specified core voltage range and wide operating temperature make it suitable for systems where operating conditions and power rails must be tightly controlled.

Engineers and procurement teams aiming for scalable FPGA-based designs will find the MPF200TS-FCSG536I suitable for applications that combine custom digital processing, interface consolidation, and industrial environmental requirements, backed by RoHS-compliant manufacturing.

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