MPF200TS-FCG784I

The MPF200TS-FCG784I is a PolarFire™ field programmable gate array (FPGA) IC offered in a 784-FCBGA package. It provides a high logic capacity and significant on-chip memory in a surface-mount, industrial-grade device designed for systems that require dense logic, substantial I/O, and extended operating temperature range.

With 192,000 logic elements, approximately 13.6 Mbits of embedded memory and 364 I/Os, this device targets applications that need integration of complex digital functions while maintaining board-level density and industrial robustness.

Key Features

• Logic Capacity — 192,000 logic elements and 48,000 logic blocks provide abundant resources for implementing complex digital designs and custom compute architectures.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, LUT storage, and intermediate data handling in signal processing or control functions.
• I/O Density — 364 general-purpose I/Os to support multi-channel interfaces, sensor arrays, and rich peripheral connectivity.
• Power Supply — Specified voltage range from 970 mV to 1.08 V for the device supply, enabling predictable integration with system power rails.
• Package & Mounting — 784-BBGA / 784-FCBGA (29x29) surface-mount package for high-density PCB designs and reliable board assembly.
• Industrial Grade & Temperature Range — Rated for industrial applications with an operating temperature range of −40 °C to 100 °C to support deployment in demanding environments.
• Compliance — RoHS-compliant construction for regulatory and environmental compatibility.

Typical Applications

• Industrial Control Systems — Use the industrial-grade temperature range and robust logic capacity for motor control, PLCs, and factory automation modules.
• High-density I/O Interfaces — Leverage 364 I/Os for multi-sensor aggregation, interface bridging, and custom protocol implementations.
• Embedded Signal Processing — Deploy the large logic fabric and embedded memory for real-time filtering, data aggregation, and pre-processing tasks.
• Custom Compute & Acceleration — Implement application-specific accelerators and control logic where a combination of logic density and on-chip RAM is required.

Unique Advantages

• High Logic Integration: 192,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components and board complexity.
• Substantial Embedded Memory: Approximately 13.6 Mbits of on-chip RAM supports larger data buffers and local storage for deterministic processing without relying on external memory.
• Extensive I/O Count: 364 I/Os simplify system-level routing for multi-channel designs and reduce the need for additional interface chips.
• Industrial Readiness: Specified for −40 °C to 100 °C operation and labeled industrial grade to meet harsher environmental requirements.
• Compact, Assembly-friendly Package: 784-FCBGA surface-mount format offers high pin density in a single, manufacturable footprint for modern PCB layouts.
• Regulatory Compliance: RoHS-compliant construction supports environmental and sourcing requirements.

Why Choose MPF200TS-FCG784I?

The MPF200TS-FCG784I delivers a balance of logic capacity, on-chip memory, and extensive I/O in an industrial-grade, surface-mount FCBGA package. Its specification set is suited to designers who need to integrate complex digital functions and substantial interfacing within a single FPGA while maintaining temperature resilience for industrial environments.

This device is well matched to development teams and procurement organizations seeking a scalable, high-density FPGA platform that provides long-term value through integration, reduced BOM, and support for demanding operating conditions.

Request a quote or submit an RFQ to receive pricing and availability for the MPF200TS-FCG784I and to discuss how this FPGA can fit into your next design.