MPF200TS-1FCG484I

The MPF200TS-1FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering a high-density programmable fabric in a 484-pin FCBGA package. It provides a large logic capacity together with significant on-chip memory and flexible I/O for industrial-grade embedded designs.

Designed for surface-mount assembly, this device supports operation across an industrial temperature range and runs from a low-voltage core supply, making it suitable for robust, space-constrained systems that require programmable logic, deterministic behavior, and board-level integration.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM for buffering, data storage, and algorithm state retention without external memory.
• I/O Resources — 244 I/O pins to support a wide range of peripheral interfaces and board-level connectivity options.
• Power — Core voltage supply range from 970 mV to 1.08 V to match low-voltage system designs.
• Package & Mounting — 484-FCBGA (23×23) / 484-BBGA package in a surface-mount form factor for compact, high-density PCB layouts.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement deterministic control logic, signal conditioning, and real-time processing for factory automation and machine control systems.
• Embedded Systems — Provide custom processing blocks, hardware acceleration, and system glue logic in space-constrained embedded platforms.
• Communications Infrastructure — Support protocol handling, packet processing, and interface bridging using the device’s logic density and abundant I/O.

Unique Advantages

• High Logic Density: 192,000 logic elements enable substantial on-chip implementation of custom logic and accelerators, reducing dependency on external processors.
• Significant Embedded Memory: Approximately 13.62 Mbits of RAM lowers external memory requirements for buffering and data-intensive tasks.
• Generous I/O Count: 244 I/Os allow flexible interfacing with sensors, peripherals, and system buses without extensive board-level multiplexing.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 484-FCBGA (23×23) package supports high-density PCB designs while maintaining board-level reliability.
• Low-Voltage Core: 0.97–1.08 V supply range aligns with modern low-power system architectures.

Why Choose MPF200TS-1FCG484I?

The MPF200TS-1FCG484I positions itself as a robust, high-capacity programmable logic device for industrial and embedded designs that require substantial on-chip logic and memory in a compact surface-mount BGA package. Its combination of 192,000 logic elements, approximately 13.62 Mbits of embedded RAM, and 244 I/Os supports integration of complex functions while minimizing external components.

This device is well suited to engineers and teams building industrial control, embedded processing, or communications equipment who need a scalable, programmable platform rated for extended temperature operation and RoHS compliance. Its package and power characteristics facilitate board-level integration in space- and power-constrained systems.

Request a quote or submit an inquiry to receive pricing and availability information for MPF200TS-1FCG484I and to discuss how it can meet your project requirements.