MPF200TLS-FCSG325I

The MPF200TLS-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring substantial logic capacity and flexible I/O. It integrates 192,000 logic elements and approximately 13.62 Mbits of embedded memory to support complex digital functions while offering a broad operating temperature range and RoHS compliance.

This device targets system designers in industrial and embedded markets who need high-density programmable logic in a compact surface-mount package with a defined core supply range and industrial temperature tolerance.

Key Features

• Logic Capacity — 192,000 logic elements to implement large combinational and sequential designs within a single FPGA.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing.
• I/O Count — 170 general-purpose I/O pins to support diverse sensor, actuator, and peripheral interfacing needs.
• Power — Core voltage supply range from 970 mV to 1.08 V, enabling integration with typical low-voltage system power rails.
• Package — 325-LFBGA, FC package (supplier device package: 325-FCBGA, 11×14.5 mm) in a surface-mount format for compact board layouts.
• Operating Temperature — Rated for −40 °C to 100 °C to meet industrial environmental requirements.
• Mounting and Compliance — Surface-mount device with RoHS compliance for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control — Use the FPGA’s large logic capacity and 170 I/O to implement motor control, PLC interfaces, and real-time control logic tolerant of industrial temperature ranges.
• Data Aggregation and Preprocessing — On-chip memory and extensive logic resources enable aggregation, buffering, and preprocessing of sensor or field data before passing to host processors.
• Custom Protocol Bridging — Implement protocol translation and custom I/O handling in space-constrained designs using the compact 325-LFBGA package.

Unique Advantages

• High logic density: 192,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 13.62 Mbits of on-chip RAM supports local buffering and state retention without external memory.
• Robust industrial operation: Rated from −40 °C to 100 °C to maintain functionality across industrial temperature extremes.
• Compact surface-mount package: 325-LFBGA (325-FCBGA, 11×14.5 mm) enables dense PCB layouts while providing ample I/O.
• Controlled core supply range: 970 mV to 1.08 V core voltage specification aids predictable power design and integration with low-voltage rails.
• RoHS compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose MPF200TLS-FCSG325I?

The MPF200TLS-FCSG325I positions itself as a high-capacity, industrial-grade FPGA that balances logic density, embedded memory, and a broad operating temperature range. Its 192,000 logic elements and approximately 13.62 Mbits of on-chip RAM make it suitable for consolidating complex digital functions and reducing external component count.

Designers targeting industrial automation, data aggregation, or custom protocol implementations will find the device’s 170 I/O, compact 325-LFBGA surface-mount package, and defined core voltage range useful for creating robust, space-efficient systems with predictable electrical and thermal behavior.

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