MPF200TL-FCVG484I

The MPF200TL-FCVG484I is a PolarFire™ field programmable gate array (FPGA) designed for industrial-grade embedded logic implementations. It integrates a high-density logic fabric with substantial on-chip memory and a broad I/O count to support complex, reconfigurable hardware functions.

Key characteristics include 192,000 logic elements, approximately 13.6 Mbits of embedded memory, 284 user I/Os, and support for a 970 mV to 1.08 V core supply, all in a 484-BFBGA surface-mount package rated for −40 °C to 100 °C operation.

Key Features

• Core Logic  192,000 logic elements provide a high-density programmable fabric for implementing custom digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM supports data buffering, look-up tables, and state storage for complex designs.
• I/O Capacity  284 user I/Os enable wide interfacing options for sensors, peripherals, and high-pin-count designs.
• Power  Core supply range from 970 mV to 1.08 V enables integration with low-voltage power domains and accurate power budgeting.
• Package & Mounting  Available in a 484-BFBGA package (supplier package 484-FPBGA, 19 × 19 mm) and designed for surface-mount assembly to support compact PCB layouts.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet the needs of temperature-challenging environments.
• Compliance  RoHS compliant to support environmentally regulated manufacturing and supply chains.

Typical Applications

• Industrial Automation  Use the industrial-grade temperature range and high logic density to implement motor control, PLC functions, and deterministic I/O processing.
• Embedded Systems  Deploy custom hardware accelerators, protocol converters, and control logic using the extensive logic elements and on-chip memory.
• High-Density I/O Interfaces  Leverage 284 I/Os for multi-channel sensor aggregations, parallel data acquisition, or board-level protocol multiplexing.

Unique Advantages

• High logic capacity: 192,000 logic elements enable sophisticated custom logic implementations without offloading to external ASICs.
• Significant on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O availability: 284 user I/Os simplify integration with multiple peripherals and external devices, lowering system routing complexity.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in temperature-sensitive industrial environments.
• Compact, surface-mount package: 484-BFBGA (19 × 19 mm supplier footprint) enables dense PCB designs while maintaining manufacturability.
• Regulatory alignment: RoHS compliance facilitates use in regulated manufacturing and assembly processes.

Why Choose MPF200TL-FCVG484I?

The MPF200TL-FCVG484I delivers a balanced combination of high logic density, substantial embedded memory, and broad I/O in a compact, surface-mount 484-BFBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded designs that require reprogrammable hardware and reliable operation across a wide thermal range.

This part is well suited for engineers building scalable, custom hardware solutions that need on-chip resources to minimize external components and simplify system architecture, while maintaining manufacturability in industrial applications.

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